SLOS414K May   2003  – April 2022 LM2904-Q1 , LM2904B-Q1 , LM2904BA-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: LM2904B-Q1 and LM2904BA-Q1
    6. 7.6 Electrical Characteristics: LM2904-Q1, LM2904AV-Q1, LM2904V-Q1
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Unity-Gain Bandwidth
      2. 9.3.2 Slew Rate
      3. 9.3.3 Input Common Mode Range
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
  • PW|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) LM2904-Q1, LM2904AV-Q1, LM2904B-Q1, LM2904BA-Q1, LM2904V-Q1(2) UNIT
D (SOIC) DGK (VSSOP) PW (TSSOP)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 124.7 186.1 171.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66.9 77.1 68.8 °C/W
RθJB Junction-to-board thermal resistance 67.9 107.7 99.2 °C/W
ψJT Junction-to-top characterization parameter 19.2 17.2 11.5 °C/W
ψJB Junction-to-board characterization parameter 67.2 106.1 97.9 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) For a listing of which devices are available in what packages, see Section 5.