SNVS684D November   2010  – March 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 3-V LM2936Q
    6. 6.6 Electrical Characteristics for 3.3-V LM2936Q
    7. 6.7 Electrical Characteristics for 5-V LM2936Q
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Input Operating Voltage
      2. 7.3.2 Thermal Shutdown (TSD)
      3. 7.3.3 Short-Circuit Current Limit
      4. 7.3.4 Shutdown (SD) Pin
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
          1. 8.2.2.1.1 Minimum Capacitance
          2. 8.2.2.1.2 ESR Limits
        2. 8.2.2.2 Output Capacitor ESR
        3. 8.2.2.3 Power Dissipation
        4. 8.2.2.4 Estimating Junction Temperature
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM2936Q ultralow quiescent current regulator features low dropout voltage and low current in the standby mode. The LM2936Q has a 40-V maximum operating voltage limit, a −40°C to +125°C operating temperature range, –24-V input transient protection, and ±3% output voltage tolerance over the entire output current, input voltage, and temperature range The WEBENCH® software may be used to generate complete designs. When generating a design, WEBENCH utilizes iterative design procedure and accesses comprehensive databases of components. See www.ti.com for more details.

8.2 Typical Application

Figure 20 shows the typical application circuit for the LM2936Q. For the LM2936Q 5-V option, the output capacitor, COUT, must have a capacitance value of at least 10 µF with an equivalent series resistance (ESR) of at least 0.3 Ω, but no more than 8 Ω. For the LM2936Q 3-V and 3.3-V options, the output capacitor, COUT, must have a capacitance value of at least 22 µF with an ESR of at least 0.3 Ω, but no more than 8 Ω. The minimum capacitance value and the ESR requirements apply across the entire expected operating ambient temperature range.

LM2936Q sim_sch_snvs684.gif
* CIN is required only if the regulator is located more than 3 inches from the power-supply-filter capacitors.
** Required for stability. COUT must be at least 10 µF for the LM2936Q 5-V option, and at least 22 µF for the 3-V and 3.3-V options. Capacitance must be maintained over entire expected operating temperature range, and located as close as possible to the regulator. The ESR, of the COUT capacitor must at least 0.3 Ω, but no more than 8 Ω.
Figure 20. LM2936Q Typical Application

8.2.1 Design Requirements

Table 1. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE
Input voltage 5.5 V to 40 V
Output voltage 5 V
Output current requirement 1 mA to 50 mA
Input capacitor 0.1 µF
Output capacitance 10 µF minimum
Output capacitor ESR value 0.3 Ω to 8 Ω

8.2.2 Detailed Design Procedure

8.2.2.1 External Capacitors

The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both ESR and minimum amount of capacitance.

8.2.2.1.1 Minimum Capacitance

The minimum output capacitance required to maintain stability is at least 10 µF for the LM2936Q 5-V option, and at least 22 µF for the 3-V and 3.3-V options. This value may be increased without limit. Larger values of output capacitance will give improved transient response.

8.2.2.1.2 ESR Limits

The ESR of the output capacitor causes loop instability if it is too high, or too low. The ESR of the COUT capacitor must at least 0.3 Ω, but no more than 8 Ω.

8.2.2.2 Output Capacitor ESR

It is essential that the output capacitor meet the capacitance and ESR requirements, or oscillations can result. The ESR is used with the output capacitance in order to produce a zero in the control loop frequency response. This zero increases phase margin and ensures stability of the output voltage. Refer to ESR, Stability, and the LDO Regulator (SLVA115) for details.

Ceramic capacitors (MLCC) can be used for COUT only if a series resistor is added to simulate the ESR requirement. The ESR is not optional — it is mandatory. Typically, a 500-mΩ to 1-Ω series resistor is used for this purpose. When using MLCCs, due diligence must be given to initial tolerances, capacitance derating due to applied DC voltage, and capacitance variations due to temperature. Dielectric types X5R and X7R are preferred.

8.2.2.3 Power Dissipation

Knowing the device power dissipation and proper sizing of the thermal plane connected to the tab or pad is critical to ensuring reliable operation. Device power dissipation depends on input voltage, output voltage, and load conditions and can be calculated with Equation 1.

Equation 1. PD(MAX) = (VIN(MAX) – VOUT) × IOUT

Power dissipation can be minimized, and greater efficiency can be achieved, by using the lowest available voltage drop option that would still be greater than the dropout voltage (VDO). However, keep in mind that higher voltage drops result in better dynamic (that is, PSRR and transient) performance.

On the 8-pin SOIC (D) package, the four ground pins are thermally connected to the backside of the die. Adding approximately 0.04 square inches of 2 oz. copper pad area to these four pins improves the JEDEC RθJA rating from 111.4°C/W to approximately 100°C/W. If this extra copper area is placed directly beneath the SOIC package there should not be any impact on board density.

Power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance (RθJA) of the combined PCB and device package and the temperature of the ambient air (TA), according to Equation 2 or Equation 2:

Equation 2. TJ(MAX) = TA(MAX) + ( RθJA × PD(MAX))
Equation 3. PD = TJ(MAX) – TA(MAX) / RθJA

Unfortunately, this RθJA is highly dependent on the heat-spreading capability of the particular PCB design, and therefore varies according to the total copper area, copper weight, and location of the planes. The RθJA recorded in Thermal Information is determined by the specific EIA/JEDEC JESD51-7 standard for PCB and copper-spreading area, and is to be used only as a relative measure of package thermal performance. For a well-designed thermal layout, RθJA is actually the sum of the package junction-to-case (bottom) thermal resistance (RθJCbot) plus the thermal resistance contribution by the PCB copper area acting as a heat sink.

8.2.2.4 Estimating Junction Temperature

The EIA/JEDEC standard recommends the use of psi (Ψ) thermal characteristics to estimate the junction temperatures of surface mount devices on a typical PCB board application. These characteristics are not true thermal resistance values, but rather package specific thermal characteristics that offer practical and relative means of estimating junction temperatures. These psi metrics are determined to be significantly independent of copper-spreading area. The key thermal characteristics (ΨJT and ΨJB) are given in Thermal Information and are used in accordance with Equation 4 or Equation 5.

Equation 4. TJ(MAX) = TTOP + (ΨJT × PD(MAX))

where

  • PD(MAX) is explained in Equation 3
  • TTOP is the temperature measured at the center-top of the device package.
Equation 5. TJ(MAX) = TBOARD + (ΨJB × PD(MAX))

where

  • PD(MAX) is explained in Equation 3.
  • TBOARD is the PCB surface temperature measured 1-mm from the device package and centered on the package edge.

For more information about the thermal characteristics ΨJT and ΨJB, see Semiconductor and IC Package Thermal Metrics (SPRA953); for more information about measuring TTOP and TBOARD, see Using New Thermal Metrics (SBVA025); and for more information about the EIA/JEDEC JESD51 PCB used for validating RθJA, see Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs (SZZA017). These application notes are available at www.ti.com.

8.2.3 Application Curve

LM2936Q 00975923.png Figure 21. LM2936Q VOUT vs VIN