SNVS684D November   2010  – March 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 3-V LM2936Q
    6. 6.6 Electrical Characteristics for 3.3-V LM2936Q
    7. 6.7 Electrical Characteristics for 5-V LM2936Q
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Input Operating Voltage
      2. 7.3.2 Thermal Shutdown (TSD)
      3. 7.3.3 Short-Circuit Current Limit
      4. 7.3.4 Shutdown (SD) Pin
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
          1. 8.2.2.1.1 Minimum Capacitance
          2. 8.2.2.1.2 ESR Limits
        2. 8.2.2.2 Output Capacitor ESR
        3. 8.2.2.3 Power Dissipation
        4. 8.2.2.4 Estimating Junction Temperature
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (March 2013) to D Revision

  • Added Pin Configuration and Functions section, ESD Rating table, Thermal Information table with updated values, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed θJA for SOIC from 140°C/W to 111.4°C/W; for TO-252 from 136°C/W to 50.5°C/W; for VSSOP from 200°C/W to 173.4°C/W; and for SOT-223 from149°C/W to 62.8°C/WGo
  • Changed θJC for SOIC from 45°C/W to 56.3°C/W (top); TO-252 from 6°C/W to 52.6°C/W (top) and 1.6°C/W (bottom); SOT-223 from 36°C/W to 44.2°C/W (top) Go

Changes from B Revision (May 2012) to C Revision

  • Changed layout of National Data Sheet to TI formatGo