SNVS100F March   2000  – July 2014 LM2937

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: LM2937-5
    6. 6.6  Electrical Characteristics: LM2937-8
    7. 6.7  Electrical Characteristics: LM2937-10
    8. 6.8  Electrical Characteristics: LM2937-12
    9. 6.9  Electrical Characteristics: LM2937-15
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Thermal Shutdown (TSD)
      2. 7.3.2 Short Circuit Current Limit
      3. 7.3.3 Overvoltage Shutdown (OVSD)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
        2. 8.2.2.2 Output Capacitor ESR
        3. 8.2.2.3 Heatsinking
        4. 8.2.2.4 Heatsinking TO-220 Package Parts
        5. 8.2.2.5 Heatsinking DDPAK/TO-263 and SOT-223 Package Parts
        6. 8.2.2.6 SOT-223 Soldering Recommendations
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

The dynamic performance of the LM2937 is dependent on the layout of the PCB. PCB layout practices that are adequate for typical LDO's may degrade the PSRR, noise, or transient performance of the LM2937. Best performance is achieved by placing CIN and COUT on the same side of the PCB as the LM2937, and as close as is practical to the package. The ground connections for CIN and COUT should be back to the LM2937 ground pin using as wide, and as short, of a copper trace as is practical.

Connections using long trace lengths, narrow trace widths, and/or connections through vias should be avoided as these will add parasitic inductances and resistances that will give inferior performance, especially during transient conditions

10.2 Layout Example

SOT_223_PCB_layout.gifFigure 27. LM2937 SOT-223-4 Layout