SNVS770I June   1999  – January 2015 LM2941 , LM2941C

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM2941T, LM2941S, LM2941LD
    6. 6.6 Electrical Characteristics: LM2941CT, LM2941CS
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Short-Circuit Current Limit
      2. 7.3.2 Overvoltage Shutdown (OVSD)
      3. 7.3.3 Thermal Shutdown (TSD)
      4. 7.3.4 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With ON/OFF Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Capacitor
        2. 8.2.2.2 Setting the Output Voltage
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Thermal Considerations
      1. 10.4.1 TO-263 Mounting
      2. 10.4.2 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Definition of Terms
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NDH|5
  • NGN|8
  • KTT|5
  • KC|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from H Revision (December 2014) to I Revision

  • Changed update pin names to TI nomenclature Go

Changes from G Revision (April 2013) to H Revision

  • Added Device Information and ESD Ratings tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; updated Thermal InfoGo

Changes from F Revision (April 2013) to G Revision

  • Changed layout of National Data Sheet to TI formatGo