SNOSC66D MARCH   2012  – September 2016 LM3017

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 True Shutdown
      2. 7.3.2 Operation of the EN/MODE Pin
      3. 7.3.3 EN/MODE Control
      4. 7.3.4 Overvoltage Protection
      5. 7.3.5 Thermal Protection
      6. 7.3.6 Current Limit Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Boost Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 Start-Up Boost Mode
      5. 7.4.5 Pass-Through Mode
      6. 7.4.6 Start-Up Pass-Through Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Programming the Output Voltage
        2. 8.2.2.2  Power Inductor Selection
        3. 8.2.2.3  Setting the Output Current
        4. 8.2.2.4  Additional Slope Compensation
        5. 8.2.2.5  Current Limit With Additional Slope Compensation
        6. 8.2.2.6  Power Diode Selection
        7. 8.2.2.7  Low-Side MOSFET Selection (Switching MOSFET)
        8. 8.2.2.8  Pass MOSFET Selection (High-Side MOSFET)
        9. 8.2.2.9  Input Capacitor Selection
        10. 8.2.2.10 Output Capacitor Selection
        11. 8.2.2.11 VCC Decoupling Capacitor
        12. 8.2.2.12 Slope Compensation Ramp
        13. 8.2.2.13 Control Loop Compensation
          1. 8.2.2.13.1 Compensation Network Components Calculations
          2. 8.2.2.13.2 Compensation Design Example
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Filter Capacitors
      2. 10.1.2 Sense Lines
      3. 10.1.3 Compact Layout
      4. 10.1.4 Ground Plane and Vias
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (March 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed RθJA value in the Thermal Information table From: 36 To: 79.2Go

Changes from B Revision (November 2012) to C Revision

  • Added Updated to Rev C as Rev A and B were SVA ConfidentialsGo