SNVS421H January   2006  – October 2017 LM3100

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hysteretic Control Circuit Overview
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-up Regulator (VCC)
      2. 7.4.2 Regulation Comparator
      3. 7.4.3 Over-Voltage Comparator
      4. 7.4.4 ON-Time Timer, Shutdown
      5. 7.4.5 Current Limit
      6. 7.4.6 N-Channel Buck Switch and Driver
      7. 7.4.7 Soft-Start
      8. 7.4.8 Thermal Protection
  8. 8 Applications and Implementation
    1. 8.1 Applications Information
      1. 8.1.1 External Components
        1. 8.1.1.1 RFB1 and RFB2
        2. 8.1.1.2 RON
        3. 8.1.1.3 L
        4. 8.1.1.4 CVCC
        5. 8.1.1.5 CO and CO3
        6. 8.1.1.6 CIN and CIN3
        7. 8.1.1.7 CBST
        8. 8.1.1.8 CSS
        9. 8.1.1.9 CFB
    2. 8.2 Typical Application
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 PC Board Layout
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

10.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

10.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

10.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

10.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

10.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.