SNVS515I September   2007  – January 2018 LM3102

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
      2.      Efficiency vs Load Current (VOUT = 3.3 V)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  COT Control Circuit Overview
      2. 7.3.2  Start-Up Regulator (VCC)
      3. 7.3.3  Regulation Comparator
      4. 7.3.4  Zero Coil Current Detect
      5. 7.3.5  Overvoltage Comparator
      6. 7.3.6  Current Limit
      7. 7.3.7  N-Channel MOSFET and Driver
      8. 7.3.8  Soft-Start
      9. 7.3.9  Thermal Protection
      10. 7.3.10 Thermal Derating
    4. 7.4 Device Functional Modes
      1. 7.4.1 ON-Time Timer, Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Design Steps for the LM3102 Application
        2. 8.2.2.2 External Components
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YPA|28
  • PWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)LM3102LM3102UNIT
PWP (HTSSOP)YPA (DSBGA)
20 PINS28 PINS
RθJA Junction-to-ambient thermal resistance 30 50 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 6.5 — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.