SNVSAY1 Data sheet

SNVSAY1 June 2017 LM317HV-MIL

PRODUCTION DATA.

Package Options

Mechanical Data (Package|Pins)

NDS|2
- MMSF012A
NDT|3
- MMSF002

Thermal pad, mechanical data (Package|Pins)

Orderable Information

snvsay1_oa

6 Specifications

6.1 Absolute Maximum Ratings

See ⁽¹⁾.

	MIN	MAX	UNIT
Power dissipation	Internally limited
Input–output voltage differential	−0.3	60	V
Lead temperature (soldering, 10 seconds)		300	°C
Storage temperature, T_stg	−65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM)⁽¹⁾	±2000	V

(1) Manufacturing with less than 500-V HBM is possible with the necessary precautions.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

			MIN	MAX	UNIT
Operating junction temperature			0	125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LM317HV			UNIT
		NDT (TO-39)	NDS (TO-3)	NDE (TO-220)
		3 PINS	2 PINS	3 PINS
R_θJA	Junction-to-ambient thermal resistance	140⁽²⁾	35⁽²⁾	23.0	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	12	2.3	15.9	°C/W
R_θJB	Junction-to-board thermal resistance	—	—	4.6	°C/W
ψ_JT	Junction-to-top characterization parameter	—	—	2.5	°C/W
ψ_JB	Junction-to-board characterization parameter	—	—	4.6	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	—	0.9	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

(2) No Heat Sink

6.5 Electrical Characteristics⁽¹⁾

PARAMETER	TEST CONDITIONS			MIN	TYP	MAX	UNIT
Line Regulation	3 V ≤ V_IN − V_OUT ≤ 60 V I_L = 10 mA⁽²⁾		T_J = 25°C		0.01	0.04	%/V
Line Regulation	3 V ≤ V_IN − V_OUT ≤ 60 V I_L = 10 mA⁽²⁾		over full Operating Temperature Range		0.02	0.07	%/V
Load Regulation	10 mA ≤ I_OUT ≤ I_MAX		T_J = 25°C		0.1%	0.5%
Load Regulation	10 mA ≤ I_OUT ≤ I_MAX		over full Operating Temperature Range		0.3%	1.5%
Thermal Regulation	T_J = 25°C, 20 ms Pulse				0.04	0.07	%/W
Adjustment Pin Current					50	100	μA
Adjustment Pin Current Change	10 mA ≤ I_L ≤ I_MAX 3 V ≤ (V_IN − V_OUT) ≤ 60 V				0.2	5	μA
Reference Voltage	3 V ≤ (V_IN − V_OUT) ≤ 60 V 10 mA ≤ I_OUT ≤ I_MAX, P ≤ P_MAX			1.2	1.25	1.3	V
Temperature Stability	T_MIN ≤ T_J ≤ T_MAX				1%
Minimum Load Current	(V_IN − V_OUT) = 60 V				3.5	12	mA
Current Limit	(V_IN − V_OUT) ≤ 15 V	TO-3, TO-220 Packages		1.5	2.2	3.7	A
	(V_IN − V_OUT) ≤ 15 V	TO-39 Package		0.5	0.8	1.9	A
	(V_IN − V_OUT) ≤ 60 V	TO-3, TO-220 Packages			0.3		A
	(V_IN − V_OUT) ≤ 60 V	TO-39 Package			0.03		A
RMS Output Noise, % of V_OUT	T_J = 25°C, 10 Hz ≤ f ≤ 10 kHz				0.003%
Ripple Rejection Ratio	V_OUT = 10V, f = 120 Hz				65		dB
Ripple Rejection Ratio	C_ADJ = 10 μF			66	80		dB
Long-Term Stability	T_J = 125°C				0.3%	1%

(1) Unless otherwise specified, these specifications apply: 0°C ≤ T_J ≤ +125°C; V_IN − V_OUT = 5 V and I_OUT = 0.1 A for the TO-39 package and I_OUT = 0.5 A for the TO-3 and TO-220 packages. Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2 W for the TO-39 and 20 W for the TO-3 and TO-220. I_MAX is 1.5 A for the TO-3 and TO-220 and 0.5 A for the TO-39 package.

(2) Regulation is measured at constant junction temperature. Changes in output voltage due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used.