SNVS775L March 2000 – January 2018 LM317L-N
PRODUCTION DATA.
THERMAL METRIC(1) | LM317L-N | UNIT | ||||
---|---|---|---|---|---|---|
TO-92 | SOIC | DSBGA | ||||
3 PINS | 8 PINS | 6 PINS | ||||
0.4-in Leads | 0.125-in Leads | |||||
RθJA | Junction-to-ambient thermal resistance | 180 | 160 | 165 | 290 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | — | 80.6 | — | — | °C/W |
RθJB | Junction-to-board thermal resistance | — | — | — | — | °C/W |
ψJT | Junction-to-top characterization parameter | — | 24.7 | — | — | °C/W |
ψJB | Junction-to-board characterization parameter | — | 135.8 | — | — | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | — | — | °C/W |