SNOSB38C January   2009  – November 2017 LM3241

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Circuit Operation
      2. 7.3.2 Internal Synchronization Rectification
      3. 7.3.3 Current Limiting
      4. 7.3.4 Dynamically Adjustable Output Voltage
      5. 7.3.5 Thermal Overload Protection
      6. 7.3.6 Soft Start
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode Operation
      2. 7.4.2 Eco-mode™ Operation
      3. 7.4.3 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Inductor Selection
          1. 8.2.2.2.1 Method 1
          2. 8.2.2.2.2 Method 2
        3. 8.2.2.3 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 DSBGA Package Assembly and Use
      2. 10.1.2 Board Layout Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (April 2013) to C Revision

  • Added the Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted the maximum lead temperature parameter from the Absolute Maximum Ratings tableGo
  • Changed the minimum TJ and TA from –30°C to –40°C in the Recommended Operating Conditions tableGo
  • Added the Thermal Information tableGo
  • Added maximum values for VOUT step rise and fall times under –40°C to 85°C TA range in the System Characteristics tableGo
  • Added maximum value for turnon time under –40°C to 85°C TA range in the System Characteristics tableGo