SNVS782C October   2010  – August 2015 LM3243

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5  Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ACB
      2. 7.3.2 Bypass Operation
      3. 7.3.3 Mode Pin
      4. 7.3.4 Dynamic Adjustment Of Output Voltage
      5. 7.3.5 Internal Synchronous Rectification
      6. 7.3.6 Current Limit
      7. 7.3.7 Timed Current Limit
      8. 7.3.8 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
      2. 7.4.2 PFM Mode
      3. 7.4.3 Mode Selection
      4. 7.4.4 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Capacitor Selection
        3. 8.2.2.3 Setting The Output Voltage
          1. 8.2.2.3.1 DAC Control
          2. 8.2.2.3.2 PDM-Based VCON Signal
          3. 8.2.2.3.3 VCON Pin
        4. 8.2.2.4 EN Input Control
        5. 8.2.2.5 Start-Up
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Considerations
        1. 10.1.1.1 Energy Efficiency
        2. 10.1.1.2 EMI
      2. 10.1.2 Manufacturing Considerations
    2. 10.2 Layout Example
      1. 10.2.1 LM3243 RF Evaluation Board
      2. 10.2.2 DC-DC Converter Section
      3. 10.2.3 VBATT Star Supply Connection
    3. 10.3 DSBGA Package Assembly and Use
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (February 2013) to C Revision

  • Added Device Information and Pin Configuration and Functions sections, ESD Rating table, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo