SNVS793D November   2011  – May 2015 LM3269

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Dynamically Adjustable Output Voltage
      2. 7.3.2 Seamless Buck Transition
      3. 7.3.3 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable And Shutdown Mode
      2. 7.4.2 VCON,ON
      3. 7.4.3 Pulse Frequency Modulation (PFM) Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Setting The Output Voltage
      2. 8.1.2 Output Current Capacity
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Recommended External Components
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Input Capacitor Selection
          3. 8.2.2.1.3 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Overview
        1. 10.1.1.1 PCB
          1. 10.1.1.1.1 Energy Efficiency
          2. 10.1.1.1.2 EMI
        2. 10.1.1.2 Manufacturing Considerations
        3. 10.1.1.3 LM3269 RF Evaluation Board
        4. 10.1.1.4 Component Placement
        5. 10.1.1.5 PCB Considerations By Layer
          1. 10.1.1.5.1 VBATT
    2. 10.2 Layout Examples
    3. 10.3 DSBGA Package Assembly And Use
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

YZR Package
12-Pin DSBGA
Top View
LM3269 30173203.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NUMBER NAME
A1 NC — Non Connection. Leave this pin floating; do not connect to PVIN or PGND.
A2 NC — Non Connection. Leave this pin floating, do not connect to PVIN or PGND.
A3 PVIN P/I Power MOSFET input and power current input pin. Optional low-pass filtering may help buck and buck-boost modes for radiated EMI and noise reduction.
B1 VCON A/I Voltage Control analog input. VCON controls the output voltage in PWM and PFM modes.
B2 EN D/I Enable pin. Pulling this pin higher than 1.2 V enables part to function.
B3 PVIN P/I Power MOSFET input and power current input pin. Optional low-pass filtering may help buck and buck-boost modes for radiated EMI and noise reduction.
C1 FB A Feedback input to inverting input of error amplifier. Connect output voltage directly to this node at load point.
C2 SGND G Signal Ground for analog circuits and control circuitry.
C3 SW1 P/O Switch pin for Internal Power Switches. Connect inductor between SW1 and SW2.
D1 VOUT O Regulated output voltage of the LM3269. Connect this to a 4.7-µF ceramic output filter capacitor to GND.
D2 SW2 P/O Switch pin for Internal Power Switches. Connect inductor between SW1 and SW2.
D3 PGND G Power Ground for Power MOSFETs and gate drive circuitry.
(1) A: Analog Pin, D: Digital Pin, G: Ground Pin, P: Power Pin, I: Input Pin, O: Output Pin.