SNVS793D November   2011  – May 2015 LM3269

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Dynamically Adjustable Output Voltage
      2. 7.3.2 Seamless Buck Transition
      3. 7.3.3 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable And Shutdown Mode
      2. 7.4.2 VCON,ON
      3. 7.4.3 Pulse Frequency Modulation (PFM) Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Setting The Output Voltage
      2. 8.1.2 Output Current Capacity
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Recommended External Components
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Input Capacitor Selection
          3. 8.2.2.1.3 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Overview
        1. 10.1.1.1 PCB
          1. 10.1.1.1.1 Energy Efficiency
          2. 10.1.1.1.2 EMI
        2. 10.1.1.2 Manufacturing Considerations
        3. 10.1.1.3 LM3269 RF Evaluation Board
        4. 10.1.1.4 Component Placement
        5. 10.1.1.5 PCB Considerations By Layer
          1. 10.1.1.5.1 VBATT
    2. 10.2 Layout Examples
    3. 10.3 DSBGA Package Assembly And Use
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (May 2013) to D Revision

  • Added Device Information table, Pin Configuration and Functions section, ESD Rating table, Feature Description , Device Functional Modes, Application and Implementation, Power Supply Recommendations, Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted Recommended Capacitance Specifications table as info contained in other tablesGo

Changes from B Revision (August 2012) to C Revision

  • Changed product brief to full data sheet Go