SNVSAX2 June   2017 LM338-MIL

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 NPN Darlington Output Drive
      2. 7.3.2 Overload Block
      3. 7.3.3 Programmable Feedback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Operation With Low Input Voltage
      3. 7.4.3 Operation at Light Loads
      4. 7.4.4 Operation in Self Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Constant 5-V Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 External Capacitors
          2. 8.2.1.2.2 Load Regulation
          3. 8.2.1.2.3 Protection Diodes
        3. 8.2.1.3 Application Curves
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input and output voltage differential –0.3 40 V
Power dissipation Internally limited
Lead temperature TO-3 package (soldering, 10 s) 300 °C
TO-220 package (soldering, 4 s) 260
Operating temperature, TJ 0 125 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input-to-output voltage differential 3 40 V
Output current 5 A

6.3 Thermal Information

THERMAL METRIC(1) LM338 UNIT
NDE (TO-220) NDS (TO-CAN)
3 PINS 2 PINS
RθJA Junction-to-ambient thermal resistance 22.9 35 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.7 1 °C/W
RθJB Junction-to-board thermal resistance 4.1 — °C/W
ψJT Junction-to-top characterization parameter 2.1 — °C/W
ψJB Junction-to-board characterization parameter 4.1 — °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.7 — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.4 Electrical Characteristics

Values apply for TJ = 25°C; VIN – VOUT = 5 V; and IOUT = 10 mA (unless otherwise noted).(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VREF Reference voltage 3 V ≤ (VIN – VOUT) ≤ 35 V, 10 mA ≤ IOUT ≤ 5 A, P ≤ 50 W,
TJ = 0°C to 125°C		 1.19 1.24 1.29 V
VRLINE Line regulation 3 V ≤ (VIN – VOUT) ≤ 35 V(2) TJ = 25°C 0.005% 0.03% V
TJ = 0°C to 125°C 0.02% 0.06% V
VRLOAD Load regulation 10 mA ≤ IOUT ≤ 5 A(2) TJ = 25°C 0.1 0.5
TJ = 0°C to 125°C 0.3 1
Thermal regulation 20-ms pulse 0.002% 0.02% W
IADJ Adjustment pin current TJ = 0°C to 125°C 45 100 µA
ΔIADJ Adjustment pin current change 10 mA ≤ IOUT ≤ 5 A, 3 V ≤ (VIN – VOUT) ≤ 35 V,
TJ = 0°C to 125°C		 0.2 5 µA
ΔVR/T Temperature stability TJ = 0°C to 125°C 1
ILOAD(MIN) Minimum load current VIN – VOUT = 35 V, TJ = 0°C to 125°C 3.5 10 mA
ICL Current limit VIN – VOUT ≤ 10 V
DC, TJ = 0°C to 125°C 5 8 A
0.5-ms peak, TJ = 0°C to 125°C 7 12 A
VIN – VOUT = 30 V 1 A
VN RMS output noise
(percent of VOUT)		 10 Hz ≤ f ≤ 10 kHz 0.003%
ΔVR/ΔVIN Ripple rejection ratio VOUT = 10 V, f = 120 Hz, CADJ = 0 µF,
TJ = 0°C to 125°C		 60 dB
VOUT = 10 V, f = 120 Hz, CADJ = 10 µF,
TJ = 0°C to 125°C		 60 75 dB
Long-term stability TJ = 125°C, 1000 Hrs 0.3% 1%
(1) These specifications are applicable for power dissipations up to 50 W for the TO-3 (NDS) package and 25 W for the TO-220 (NDE) package. Power dissipation is specified at these values up to 15-V input-output differential. Above 15-V differential, power dissipation is limited by internal protection circuitry. All limits (that is, the numbers in the minimum and maximum columns) are specified to TI's AOQL (Average Outgoing Quality Level).
(2) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation.

6.5 Typical Characteristics

LM338-MIL 00906032.png Figure 1. Current Limit
LM338-MIL 00906034.png Figure 3. Current Limit
LM338-MIL 00906036.png Figure 5. Dropout Voltage
LM338-MIL 00906038.png Figure 7. Temperature Stability
LM338-MIL 00906040.png Figure 9. Minimum Operating Current
LM338-MIL 00906042.png Figure 11. Ripple Rejection
LM338-MIL 00906044.png Figure 13. Line Transient Response
LM338-MIL 00906033.png Figure 2. Current Limit
LM338-MIL 00906035.png Figure 4. Load Regulation
LM338-MIL 00906037.png Figure 6. Adjustment Current
LM338-MIL 00906039.png Figure 8. Output Impedance
LM338-MIL 00906041.png Figure 10. Ripple Rejection
LM338-MIL 00906043.png Figure 12. Ripple Rejection
LM338-MIL 00906045.png Figure 14. Load Transient Response