SNVS450F September   2006  – October 2015 LM3402 , LM3402HV

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Controlled ON-time Overview
      2. 7.3.2 Average LED Current Accuracy
      3. 7.3.3 Maximum Output Voltage
      4. 7.3.4 Minimum Output Voltage
      5. 7.3.5 High Voltage Bias Regulator
      6. 7.3.6 Internal MOSFET and Driver
      7. 7.3.7 Fast Shutdown for PWM Dimming
      8. 7.3.8 Peak Current Limit
      9. 7.3.9 Overvoltage and Overcurrent Comparator
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Power Shutdown
      2. 7.4.2 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Switching Frequency
      2. 8.1.2 LED Ripple Current
      3. 8.1.3 Buck Converters Without Output Capacitors
      4. 8.1.4 Buck Converters With Output Capacitors
      5. 8.1.5 Input Capacitors
      6. 8.1.6 Recirculating Diode
      7. 8.1.7 LED Current During DIM Mode
      8. 8.1.8 Transient Protection Considerations
        1. 8.1.8.1 CS Pin Protection
        2. 8.1.8.2 CS Pin Protection With OVP
        3. 8.1.8.3 VIN Pin Protection
        4. 8.1.8.4 General Comments Regarding Other Pins
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 RON and tON
        2. 8.2.2.2 Using an Output Capacitor
        3. 8.2.2.3 Output Inductor
          1. 8.2.2.3.1 RSNS
        4. 8.2.2.4 Input Capacitor
        5. 8.2.2.5 Recirculating Diode
          1. 8.2.2.5.1 CB and CF
        6. 8.2.2.6 Efficiency
        7. 8.2.2.7 Die Temperature
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout
      2. 10.1.2 Ground Plane and Shape Routing
      3. 10.1.3 Current Sensing
      4. 10.1.4 Remote LED Arrays
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (April 2013) to F Revision

  • Added ESD Ratings and Timing Requirements tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from D Revision (May 2013) to E Revision

  • Changed layout of National Data Sheet to TI formatGo