4 Revision History
Changes from B Revision (April 2013) to C Revision
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Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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Deleted Soldering information (220°C, maximum) from Absolute Maximum RatingsGo
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Changed Thermal resistance, θJA, in Thermal Information From: 118°C/W To: 182.9°C/WGo
Changes from A Revision (May 2013) to B Revision
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Changed layout of National Semiconductor Data Sheet to TI formatGo