SNVSB95 July   2019 LM3421-Q1 , LM3423-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Boost Application
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Current Regulators
      2. 8.3.2  Predictive Off-Time (PRO) Control
      3. 8.3.3  Average LED Current
      4. 8.3.4  Analog Dimming
      5. 8.3.5  Current Sense and Current Limit
      6. 8.3.6  Overcurrent Protection
      7. 8.3.7  Zero Current Shutdown
      8. 8.3.8  Control Loop Compensation
      9. 8.3.9  Start-Up Regulator
      10. 8.3.10 Overvoltage Lockout (OVLO)
      11. 8.3.11 Input Undervoltage Lockout (UVLO)
        1. 8.3.11.1 UVLO Only
        2. 8.3.11.2 PWM Dimming and UVLO
      12. 8.3.12 PWM Dimming
      13. 8.3.13 LM3423-Q1 Only: DPOL, FLT, TIMR, and LRDY
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Inductor
      2. 9.1.2 LED Dynamic Resistance
      3. 9.1.3 Output Capacitor
      4. 9.1.4 Input Capacitors
      5. 9.1.5 Main MOSFET / Dimming MOSFET
      6. 9.1.6 Re-Circulating Diode
      7. 9.1.7 Boost Inrush Current
      8. 9.1.8 Switching Frequency
    2. 9.2 Typical Applications
      1. 9.2.1 Basic Topology Schematics
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Operating Point
          2. 9.2.1.2.2  Switching Frequency
          3. 9.2.1.2.3  Average LED Current
          4. 9.2.1.2.4  Inductor Ripple Current
          5. 9.2.1.2.5  LED Ripple Current
          6. 9.2.1.2.6  Peak Current Limit
          7. 9.2.1.2.7  Loop Compensation
          8. 9.2.1.2.8  Input Capacitance
          9. 9.2.1.2.9  N-channel FET
            1. 9.2.1.2.9.1 Boost and Buck-Boost
          10. 9.2.1.2.10 Diode
          11. 9.2.1.2.11 Output OVLO
          12. 9.2.1.2.12 Input UVLO
          13. 9.2.1.2.13 PWM Dimming Method
          14. 9.2.1.2.14 Analog Dimming Method
      2. 9.2.2 LM3421 Buck-Boost Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1  Operating Point
          2. 9.2.2.2.2  Switching Frequency
          3. 9.2.2.2.3  Average LED Current
          4. 9.2.2.2.4  Inductor Ripple Current
          5. 9.2.2.2.5  Output Capacitance
          6. 9.2.2.2.6  Peak Current Limit
          7. 9.2.2.2.7  Loop Compensation
          8. 9.2.2.2.8  Input Capacitance
          9. 9.2.2.2.9  N-channel FET
          10. 9.2.2.2.10 Diode
          11. 9.2.2.2.11 Input UVLO
          12. 9.2.2.2.12 Output OVLO
        3. 9.2.2.3 Application Curve
      3. 9.2.3 LM3421-Q1 BOOST Application
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
      4. 9.2.4 LM3421-Q1 Buck-Boost Application
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
      5. 9.2.5 LM3423-Q1 Boost Application
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
      6. 9.2.6 LM3421 Buck-Boost Application
        1. 9.2.6.1 Design Requirements
        2. 9.2.6.2 Detailed Design Procedure
      7. 9.2.7 LM3423 Buck Application
        1. 9.2.7.1 Design Requirements
        2. 9.2.7.2 Detailed Design Procedure
      8. 9.2.8 LM3423 Buck-Boost Application
        1. 9.2.8.1 Design Requirements
        2. 9.2.8.2 Detailed Design Procedure
      9. 9.2.9 LM3421 SEPIC Application
        1. 9.2.9.1 Design Procedure
        2. 9.2.9.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 General Recommendations
    2. 10.2 Input Supply Current Limit
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.7 Boost Inrush Current

When configured as a boost converter, there is a phantom power path comprised of the inductor, the output diode, and the output capacitor. This path causes two things to happen when power is applied:

  1. a very large inrush of current to charge the output capacitor
  2. the energy stored in the inductor during this inrush collects in the output capacitor, charging it to a higher potential than the input voltage

Depending on the state of the EN pin, the output capacitor discharges by:

  1. EN < 1.3 V: no discharge path (leakage only).
  2. EN > 1.3 V, the OVP divider resistor path, if present, and 10 µA into each of the HSP & HSN pins.

In applications using the OVP divider and with EN > 1.3 V, the output capacitor voltage can charge higher than VTURN-OFF. In this situation, the FLT pin (LM3423-Q1 only) is open and the PWM dimming MOSFET is turned off. This condition (the system appearing disabled) can persist for an undesirably long time. Possible solutions to this condition include:

  • Add an inrush diode from VIN to the output as shown in Figure 30.
  • Add an NTC thermistor in series with the input to prevent the inrush from overcharging the output capacitor too high.
  • Use a current limited source supply.
  • Raise the OVP threshold.
LM3421-Q1 LM3423-Q1 300673i9.gifFigure 30. Boost Topology with Inrush Diode