SNVS603D August   2009  – July 2019 LM3424

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Typical Boost Application Circuit
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Current Regulators
      2. 7.3.2  Peak Current Mode Control
      3. 7.3.3  Average LED Current
      4. 7.3.4  Thermal Foldback and Analog Dimming
      5. 7.3.5  Current Sense and Current Limit
      6. 7.3.6  Slope Compensation
      7. 7.3.7  Control Loop Compensation
      8. 7.3.8  Start-Up Regulator and Soft-Start
      9. 7.3.9  Overvoltage Lockout (OVLO)
      10. 7.3.10 Input Undervoltage Lockout (UVLO)
        1. 7.3.10.1 UVLO Only
        2. 7.3.10.2 PWM Dimming and UVLO
      11. 7.3.11 PWM Dimming
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inductor
      2. 8.1.2 LED Dynamic Resistance
      3. 8.1.3 Output Capacitor
      4. 8.1.4 Input Capacitors
      5. 8.1.5 Main MOSFET and Dimming MOSFET
      6. 8.1.6 Re-Circulating Diode
      7. 8.1.7 Switching Frequency
    2. 8.2 Typical Applications
      1. 8.2.1 Basic Topology Schematics
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Operating Point
          2. 8.2.1.2.2  Switching Frequency
          3. 8.2.1.2.3  Average LED Current
          4. 8.2.1.2.4  Thermal Foldback
          5. 8.2.1.2.5  Inductor Ripple Current
          6. 8.2.1.2.6  LED Ripple Current
          7. 8.2.1.2.7  Peak Current Limit
          8. 8.2.1.2.8  Slope Compensation
          9. 8.2.1.2.9  Loop Compensation
          10. 8.2.1.2.10 Input Capacitance
          11. 8.2.1.2.11 NFET
          12. 8.2.1.2.12 Diode
          13. 8.2.1.2.13 Output OVLO
          14. 8.2.1.2.14 Input UVLO
          15. 8.2.1.2.15 Soft-Start
          16. 8.2.1.2.16 PWM Dimming Method
          17. 8.2.1.2.17 Analog Dimming Method
      2. 8.2.2 Buck-Boost Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1  Operating Point
          2. 8.2.2.2.2  Switching Frequency
          3. 8.2.2.2.3  Average LED Current
          4. 8.2.2.2.4  Thermal Foldback
          5. 8.2.2.2.5  Inductor Ripple Current
          6. 8.2.2.2.6  Output Capacitance
          7. 8.2.2.2.7  Peak Current Limit
          8. 8.2.2.2.8  Slope Compensation
          9. 8.2.2.2.9  Loop Compensation
          10. 8.2.2.2.10 Input Capacitance
          11. 8.2.2.2.11 NFET
          12. 8.2.2.2.12 Diode
          13. 8.2.2.2.13 Input UVLO
          14. 8.2.2.2.14 Output OVLO
          15. 8.2.2.2.15 Soft-Start
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Boost Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
      4. 8.2.4 Buck-Boost Application
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedures
      5. 8.2.5 Boost Application
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
      6. 8.2.6 Buck-Boost Application
        1. 8.2.6.1 Design Requirements
        2. 8.2.6.2 Detailed Design Procedure
      7. 8.2.7 Buck Application
        1. 8.2.7.1 Design Requirements
        2. 8.2.7.2 Detailed Design Procedure
      8. 8.2.8 Buck-Boost Application
        1. 8.2.8.1 Design Requirements
        2. 8.2.8.2 Detailed Design Procedure
      9. 8.2.9 SEPIC Application
        1. 8.2.9.1 Design Requirements
        2. 8.2.9.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 Input Supply Current Limit
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM3424 UNIT
PWP (HTSSOP)
20 PINS
RθJA Junction-to-ambient thermal resistance 36.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.5 °C/W
RθJB Junction-to-board thermal resistance 18 °C/W
ψJT Junction-to-top characterization parameter 0.5 °C/W
ψJB Junction-to-board characterization parameter 17.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).