SNVS616H April   2009  – July 2015 LM3429 , LM3429-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Current Regulators
      2. 7.3.2  Predictive Off-Time (PRO) Control
      3. 7.3.3  Switching Frequency
      4. 7.3.4  Average LED Current
      5. 7.3.5  Analog Dimming
      6. 7.3.6  Current Sense and Current Limit
      7. 7.3.7  Control Loop Compensation
      8. 7.3.8  Output Overvoltage Lockout (OVLO)
      9. 7.3.9  Input Undervoltage Lockout (UVLO)
      10. 7.3.10 PWM Dimming
      11. 7.3.11 Startup Regulator (VCC LDO)
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inductor
      2. 8.1.2 LED Dynamic Resistance (rD)
      3. 8.1.3 Output Capacitor
      4. 8.1.4 Input Capacitors
      5. 8.1.5 N-Channel MosFET (NFET)
      6. 8.1.6 Re-Circulating Diode
    2. 8.2 Typical Applications
      1. 8.2.1 Basic Topology Schematics
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Operating Point
          2. 8.2.1.2.2  Switching Frequency
          3. 8.2.1.2.3  Average LED Current
          4. 8.2.1.2.4  Inductor Ripple Current
          5. 8.2.1.2.5  LED Ripple Current
          6. 8.2.1.2.6  Peak Current Limit
          7. 8.2.1.2.7  Loop Compensation
          8. 8.2.1.2.8  Input Capacitance
          9. 8.2.1.2.9  NFET
          10. 8.2.1.2.10 Diode
          11. 8.2.1.2.11 Output OVLO
          12. 8.2.1.2.12 Input UVLO
          13. 8.2.1.2.13 PWM Dimming Method
          14. 8.2.1.2.14 Analog Dimming Method
      2. 8.2.2 Buck-Boost Application - 6 LEDs at 1 A
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1  Operating Point
          2. 8.2.2.2.2  Switching Frequency
          3. 8.2.2.2.3  Average LED Current
          4. 8.2.2.2.4  Inductor Ripple Current
          5. 8.2.2.2.5  Output Capacitance
          6. 8.2.2.2.6  Peak Current Limit
          7. 8.2.2.2.7  Loop Compensation
          8. 8.2.2.2.8  Input Capacitance
          9. 8.2.2.2.9  NFET
          10. 8.2.2.2.10 Diode
          11. 8.2.2.2.11 Input UVLO
          12. 8.2.2.2.12 Output OVLO
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Boost PWM Dimming Application - 9 LEDs at 1 A
        1. 8.2.3.1 Detailed Design Procedure
      4. 8.2.4 Buck-Boost Analog Dimming Application - 4 LEDs at 2A
        1. 8.2.4.1 Detailed Design Procedure
      5. 8.2.5 Boost Analog Dimming Application - 12 LEDs at 700 mA
        1. 8.2.5.1 Detailed Design Procedure
      6. 8.2.6 Buck-Boost PWM Dimming Application - 6 LEDs at 500 mA
        1. 8.2.6.1 Detailed Design Procedure
      7. 8.2.7 Buck Application - 3 LEDS at 1.25 A
        1. 8.2.7.1 Detailed Design Procedure
      8. 8.2.8 Buck-Boost Thermal Foldback Application - 8 LEDs at 2.5 A
        1. 8.2.8.1 Detailed Design Procedure
      9. 8.2.9 SEPIC Application - 5 LEDs at 750 mA
        1. 8.2.9.1 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 Input Supply Current Limit
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

PWP Package
14- Pin HTSSOP
Top View
LM3429 LM3429-Q1 30094404.gif

Pin Functions

PIN I/O DESCRIPTION APPLICATION INFORMATION
NO. NAME
1 VIN I Input Voltage Bypass with 100 nF capacitor to AGND as close to the device as possible in the circuit board layout.
2 COMP I Compensation Connect a capacitor to AGND to set compensation.
3 CSH I Current Sense High Connect a resistor to AGND to set signal current. For analog dimming, connect current source or potentiometer to AGND (see Analog Dimming section).
4 RCT I Resistor Capacitor Timing Connect a resistor from the switch node and a capacitor to AGND to set the switching frequency.
5 AGND GND Analog Ground Connect to PGND through the DAP copper circuit board pad to provide proper ground return for CSH, COMP, and RCT.
6 OVP I Overvoltage Protection Connect to a resistor divider from the output (VO) or the input to program output overvoltage lockout (OVLO). Turn-off threshold is 1.24 V and hysteresis for turn-on is provided by 20 µA current source.
7 nDIM I Not DIM input Connect a PWM signal for dimming as detailed in the PWM Dimming section and/or a resistor divider from VIN to program input undervoltage lockout (UVLO). Turn-on threshold is 1.24 V and hysteresis for turn-off is provided by 20 µA current source.
8 NC No Connection Leave open.
9 PGND GND Power Ground Connect to AGND through DAP copper pad to provide ground return for GATE.
10 GATE O Gate Drive Output Connect to the gate of the external NFET.
11 VCC I Internal Regulator Output Bypass with a 2.2 µF–3.3 µF, ceramic capacitor to PGND.
12 IS I Main Switch Current Sense Connect to the drain of the main N-channel MosFET switch for RDS-ON sensing or to a sense resistor installed in the source of the same device.
13 HSP I LED Current Sense Positive Connect through a series resistor to LED current sense resistor (positive).
14 HSN I LED Current Sense Negative Connect through a series resistor to LED current sense resistor (negative).
DAP (15) DAP GND Thermal pad on bottom of IC Connect to AGND and PGND.