SNVS682D November   2010  – December 2015 LM3444

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Theory of Operation
      2. 7.3.2 Valley-Fill Circuit
      3. 7.3.3 Valley-Fill Operation
      4. 7.3.4 Buck Converter
      5. 7.3.5 Overview Of Constant Off-Time Control
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Determining Duty-Cycle (D)
      2. 8.1.2  Calculating Off-Time
      3. 8.1.3  Setting the Switching Frequency
      4. 8.1.4  Inductor Selection
      5. 8.1.5  Setting the LED Current
      6. 8.1.6  Valley Fill Capacitors
      7. 8.1.7  Determining the Capacitance Value of the Valley-Fill Capacitors
      8. 8.1.8  Determining Maximum Number of Series Connected LEDs Allowed
      9. 8.1.9  Output Capacitor
      10. 8.1.10 Switching MOSFET
      11. 8.1.11 Recirculating Diode
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (May 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from B Revision (May 2013) to C Revision

  • Changed layout of National Data Sheet to TI formatGo