SNVS570M January   2009  – November 2015 LM3445

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Overview of Phase Control Dimming
      2. 7.3.2  Theory of Operation
      3. 7.3.3  Sensing the Rectified TRIAC Waveform
      4. 7.3.4  LM3445 Line Sensing Circuitry
      5. 7.3.5  TRIAC Holding Current Resistor
      6. 7.3.6  Angle Detect
      7. 7.3.7  Bleeder
      8. 7.3.8  FLTR1 Pin
      9. 7.3.9  Dim Decoder
      10. 7.3.10 Valley-Fill Circuit
      11. 7.3.11 Valley-Fill Operation
      12. 7.3.12 Buck Converter
      13. 7.3.13 Overview of Constant Off-Time Control
      14. 7.3.14 Master/Slave Operation
      15. 7.3.15 Master/Slave Configuration
      16. 7.3.16 Master Board Modifications
      17. 7.3.17 Slave Board Modifications
      18. 7.3.18 Master/Slave Interconnection
      19. 7.3.19 Master/Slave Theory of Operation
      20. 7.3.20 Master/Slave Connection Diagram
      21. 7.3.21 Master/Slave Block Diagrams
      22. 7.3.22 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Determining Duty-Cycle (D)
      2. 8.1.2 Calculating Off-Time
      3. 8.1.3 Setting the Switching Frequency
      4. 8.1.4 Inductor Selection
      5. 8.1.5 Setting the LED Current
      6. 8.1.6 Valley Fill Capacitors
        1. 8.1.6.1 Determining the Capacitance Value of the Valley-Fill Capacitors
        2. 8.1.6.2 Determining Maximum Number of Series Connected LEDs Allowed
      7. 8.1.7 Output Capacitor
      8. 8.1.8 Switching MOSFET
      9. 8.1.9 Re-Circulating Diode
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.