SNVS085X July   2000  – December 2017 LM3478

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical High Efficiency Step-Up (Boost) Converter
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings - LM3478
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overvoltage Protection
      2. 7.3.2 Slope Compensation Ramp
      3. 7.3.3 Frequency Adjust/Shutdown
      4. 7.3.4 Short-Circuit Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical High Efficiency Step-Up (Boost) Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design with WEBENCH Tools
          2. 8.2.1.2.2  Power Inductor Selection
          3. 8.2.1.2.3  Programming the Output Voltage
          4. 8.2.1.2.4  Setting the Current Limit
          5. 8.2.1.2.5  Current Limit with External Slope Compensation
          6. 8.2.1.2.6  Power Diode Selection
          7. 8.2.1.2.7  Power MOSFET Selection
          8. 8.2.1.2.8  Input Capacitor Selection
          9. 8.2.1.2.9  Output Capacitor Selection
          10. 8.2.1.2.10 Compensation
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical SEPIC Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Power MOSFET Selection
          2. 8.2.2.2.2 Power Diode Selection
          3. 8.2.2.2.3 Selection of Inductors L1 and L2
          4. 8.2.2.2.4 Sense Resistor Selection
          5. 8.2.2.2.5 Sepic Capacitor Selection
          6. 8.2.2.2.6 Input Capacitor Selection
          7. 8.2.2.2.7 Output Capacitor Selection
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Custom Design with WEBENCH Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Related Links
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from W Revision (December 2014) to X Revision

  • Deleted LM3478Q-Q1 device. See LM3478Q-Q1 data sheet Go
  • Changed package from "DCK" to "DGK" for LM3478 and LM3478-Q1 devices in the Thermal Information table; changed pin complement from "3" to "8" for the D, and DGK packagesGo
  • Changed RθJA for the D package from "157.2" to "105.3" °C/WGo
  • Changed RθJC(top) for the D package from "49.9" to "50.3" °C/WGo
  • Changed RθJB for the D package from "77.1" to "55.8" °C/WGo
  • Changed ψJT for the D package from "4.7" to "6.8" °C/WGo
  • Changed ψJB for the D package from "75.8" to "54.7" °C/WGo

Changes from V Revision (February 2013) to W Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted Thermal Resistance parameter from Electrical CharacteristicsGo

Changes from U Revision (February 2013) to V Revision