SNVSAX8 April   2018 LM3478Q-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical High Efficiency Step-Up (Boost) Converter
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings - LM3478Q-Q1
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overvoltage Protection
      2. 7.3.2 Slope Compensation Ramp
      3. 7.3.3 Frequency Adjust/Shutdown
      4. 7.3.4 Short-Circuit Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical High Efficiency Step-Up (Boost) Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design with WEBENCH Tools
          2. 8.2.1.2.2  Power Inductor Selection
          3. 8.2.1.2.3  Programming the Output Voltage
          4. 8.2.1.2.4  Setting the Current Limit
          5. 8.2.1.2.5  Current Limit with External Slope Compensation
          6. 8.2.1.2.6  Power Diode Selection
          7. 8.2.1.2.7  Power MOSFET Selection
          8. 8.2.1.2.8  Input Capacitor Selection
          9. 8.2.1.2.9  Output Capacitor Selection
          10. 8.2.1.2.10 Compensation
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical SEPIC Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Power MOSFET Selection
          2. 8.2.2.2.2 Power Diode Selection
          3. 8.2.2.2.3 Selection of Inductors L1 and L2
          4. 8.2.2.2.4 Sense Resistor Selection
          5. 8.2.2.2.5 Sepic Capacitor Selection
          6. 8.2.2.2.6 Input Capacitor Selection
          7. 8.2.2.2.7 Output Capacitor Selection
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Custom Design with WEBENCH Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted) (1)
MIN MAX UNIT
Input Voltage 45 V
FB Pin Voltage –0.4< V V FB< 7 V
FA/SD Pin Voltage –0.4 < VFA/SD VFA/SD< 7 V
Peak Driver Output Current (<10µs) 1 A
Power Dissipation Internally Limited
Junction Temperature +150 °C
Lead Temperature Vapor Phase (60 s) 215 °C
Infrared (15 s) 260 °C
DR Pin Voltage –0.4 ≤ VDR VDR ≤ 8 V
ISEN Pin Voltage 500 mV
Tstg Storage temperature −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.