SNVS178H January   2002  – December 2015 LM3485

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hysteretic Control Circuit
      2. 7.3.2 Current Limit Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start Up
      2. 7.4.2 External Sense Resistor
      3. 7.4.3 PGATE
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step by Step Design Procedure
        2. 8.2.2.2 Inductor Selection (L1)
        3. 8.2.2.3 Output Voltage Set Point
        4. 8.2.2.4 Output Capacitor Selection (COUT)
        5. 8.2.2.5 Input Capacitor Selection (CIN)
        6. 8.2.2.6 Programming the Current Limit (RADJ)
        7. 8.2.2.7 Catch Diode Selection (D1)
        8. 8.2.2.8 P-Channel MOSFET Selection (Q1)
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from G Revision (February 2013) to H Revision

  • Added ESD Ratings, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from F Revision (February 2013) to G Revision

  • Changed layout of National Data Sheet to TI formatGo