SNVS089O July   2000  – July 2015 LM3488

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings : LM3488
    3. 6.3 ESD Ratings: LM3488-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Slope Compensation Ramp
      2. 7.3.2 Frequency Adjust/Synchronization/Shutdown
      3. 7.3.3 Short-Circuit Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Boost Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design with WEBENCH Tools
          2. 8.2.1.2.2 Power Inductor Selection
          3. 8.2.1.2.3 Programming the Output Voltage
          4. 8.2.1.2.4 Setting the Current Limit
          5. 8.2.1.2.5 Current Limit with External Slope Compensation
          6. 8.2.1.2.6 Power Diode Selection
          7. 8.2.1.2.7 Power MOSFET Selection
          8. 8.2.1.2.8 Input Capacitor Selection
          9. 8.2.1.2.9 Output Capacitor Selection
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Designing SEPIC Using LM3488
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Power MOSFET Selection
          2. 8.2.2.2.2 Power Diode Selection
          3. 8.2.2.2.3 Selection Of Inductors L1 and L2
          4. 8.2.2.2.4 Sense Resistor Selection
          5. 8.2.2.2.5 SEPIC Capacitor Selection
          6. 8.2.2.2.6 Input Capacitor Selection
          7. 8.2.2.2.7 Output Capacitor Selection
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Custom Design with WEBENCH Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.