SNVS089O July   2000  – July 2015 LM3488

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings : LM3488
    3. 6.3 ESD Ratings: LM3488-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Slope Compensation Ramp
      2. 7.3.2 Frequency Adjust/Synchronization/Shutdown
      3. 7.3.3 Short-Circuit Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Boost Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design with WEBENCH Tools
          2. 8.2.1.2.2 Power Inductor Selection
          3. 8.2.1.2.3 Programming the Output Voltage
          4. 8.2.1.2.4 Setting the Current Limit
          5. 8.2.1.2.5 Current Limit with External Slope Compensation
          6. 8.2.1.2.6 Power Diode Selection
          7. 8.2.1.2.7 Power MOSFET Selection
          8. 8.2.1.2.8 Input Capacitor Selection
          9. 8.2.1.2.9 Output Capacitor Selection
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Designing SEPIC Using LM3488
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Power MOSFET Selection
          2. 8.2.2.2.2 Power Diode Selection
          3. 8.2.2.2.3 Selection Of Inductors L1 and L2
          4. 8.2.2.2.4 Sense Resistor Selection
          5. 8.2.2.2.5 SEPIC Capacitor Selection
          6. 8.2.2.2.6 Input Capacitor Selection
          7. 8.2.2.2.7 Output Capacitor Selection
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Custom Design with WEBENCH Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from N Revision (December 2014) to O Revision

  • Changed Datasheet title Go
  • Changed Handling Ratings to ESD Ratings Go

Changes from M Revision (March 2013) to N Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed ESD Table and Features sectionGo
  • Changed application information. Go

Changes from L Revision (March 2013) to M Revision

  • Changed layout of National Data Sheet to TI format Go