SNVS799H April   2012  – November 2017 LM34927

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Control Overview
      2. 7.3.2  VCC Regulator
      3. 7.3.3  Regulation Comparator
      4. 7.3.4  Overvoltage Comparator
      5. 7.3.5  On-Time Generator
      6. 7.3.6  Current Limit
      7. 7.3.7  N-Channel Buck Switch and Driver
      8. 7.3.8  Synchronous Rectifier
      9. 7.3.9  Undervoltage Detector
      10. 7.3.10 Thermal Protection
      11. 7.3.11 Ripple Configuration
      12. 7.3.12 Soft Start
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Application Circuit: 20-V to 95-V Input and 10-V, 300-mA Output Isolated Fly-Buck Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Transformer Turns Ratio
          2. 8.2.1.2.2  Total IOUT
          3. 8.2.1.2.3  RFB1, RFB2
          4. 8.2.1.2.4  Frequency Selection
          5. 8.2.1.2.5  Transformer Selection
          6. 8.2.1.2.6  Primary Output Capacitor
          7. 8.2.1.2.7  Secondary Output Capacitor
          8. 8.2.1.2.8  Type III Feedback Ripple Circuit
          9. 8.2.1.2.9  Secondary Diode
          10. 8.2.1.2.10 VCC and Bootstrap Capacitor
          11. 8.2.1.2.11 Input Capacitor
          12. 8.2.1.2.12 UVLO Resistors
          13. 8.2.1.2.13 VCC Diode
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Curves
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DDA Package
8-Pin SO PowerPAD
Top View
LM34927 HSOIC8 Pinout.gif
Connect Exposed Pad to RTN
8-Pin WSON With Exposed Thermal Pad
NGU Package
Top View
LM34927 30177903.gif

Pin Functions

PIN I/O DESCRIPTION APPLICATION INFORMATION
NO. NAME
1 RTN — Ground Ground connection of the integrated circuit.
2 VIN I Input voltage Operating input range is 7.5 V to 100 V.
3 UVLO I Input pin of undervoltage comparator Resistor divider from VIN to UVLO to GND programs the undervoltage detection threshold. An internal current source is enabled when UVLO is above 1.225 V to provide hysteresis. When UVLO pin is pulled below 0.66 V externally, the parts goes in shutdown mode.
4 RON I On-time control A resistor between this pin and VIN sets the switch on-time as a function of VIN. Minimum recommended on-time is 100 ns at max input voltage.
5 FB I Feedback This pin is connected to the inverting input of the internal regulation comparator. The regulation level is 1.225 V.
6 VCC O Output from the internal high voltage series pass regulator; regulated at
7.6 V.		 The internal VCC regulator provides bias supply for the gate drivers and other internal circuitry. A 1.0-μF decoupling capacitor is recommended.
7 BST I Bootstrap capacitor An external capacitor is required between the BST and SW pins (0.01-μF ceramic). The BST pin capacitor is charged by the VCC regulator through an internal diode when the SW pin is low.
8 SW O Switching node Power switching node. Connect to the output inductor and bootstrap capacitor.
— EP — Exposed pad Exposed pad must be connected to RTN pin. Connect to system ground plane on application board for reduced thermal resistance.