6 Specifications
6.1 Absolute Maximum Ratings
See (1)
|
MIN |
MAX |
UNIT |
VIN, UVLO to RTN |
–0.3 |
100 |
V |
SW to RTN |
–1.5 |
VIN + 0.3 |
V |
SW to RTN (100-ns transient) |
–5 |
VIN + 0.3 |
V |
BST to VCC |
|
100 |
V |
BST to SW |
|
13 |
V |
RON to RTN |
–0.3 |
100 |
V |
VCC to RTN |
–0.3 |
13 |
V |
FB to RTN |
–0.3 |
5 |
V |
Maximum junction temperature(2) |
|
150 |
°C |
Storage temperature range |
–55 |
150 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.
6.2 ESD Ratings
|
VALUE |
UNIT |
V(ESD) |
Electrostatic discharge |
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) |
±2000 |
V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) |
±750 |
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
|
MIN |
MAX |
UNIT |
VIN voltage |
7.5 |
100 |
V |
Operating junction temperature(1) |
–40 |
125 |
°C |
(1) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.
6.4 Thermal Information
THERMAL METRICS(1) |
LM34927 |
UNIT |
NGU (WSON) |
DDA (SO PowerPAD) |
8 PINS |
RθJA |
Junction-to-ambient thermal resistance |
41.3 |
41.1 |
°C/W |
RθJCbot |
Junction-to-case (bottom) thermal resistance |
3.2 |
2.4 |
°C/W |
ΨJB |
Junction-to-board thermal characteristic parameter |
19.2 |
24.4 |
°C/W |
RθJB |
Junction-to-board thermal resistance |
19.1 |
30.6 |
°C/W |
RθJCtop |
Junction-to-case (top) thermal resistance |
34.7 |
37.3 |
°C/W |
ΨJT |
Junction-to-top thermal characteristic parameter |
0.3 |
6.7 |
°C/W |
6.5 Electrical Characteristics
Typical values correspond to TJ = 25°C. Minimum and maximum limits apply over –40°C to 125°C junction temperature range, unless otherwise stated. VIN = 48 V unless otherwise stated. See(1).
PARAMETER |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
VCC SUPPLY |
VCC Reg |
VCC Regulator Output |
VIN = 48 V, ICC = 20 mA |
6.25 |
7.6 |
8.55 |
V |
|
VCC Current Limit |
VIN = 48 V(2) |
26 |
|
|
mA |
|
VCC UVLO Threshold (VCC increasing) |
|
4.15 |
4.5 |
4.9 |
V |
|
VCC UVLO Hysteresis |
|
|
300 |
|
mV |
|
VCC Dropout Voltage |
VIN = 8 V, ICC = 20 mA |
|
2.3 |
|
V |
|
IIN Operating Current |
Non-switching, FB = 3 V |
|
1.75 |
|
mA |
|
IIN Shutdown Current |
UVLO = 0 V |
|
50 |
225 |
µA |
UNDERVOLTAGE SENSING FUNCTION |
|
UV Threshold |
UV Rising |
1.19 |
1.225 |
1.26 |
V |
|
UV Hysteresis Input Current |
UV = 2.5 V |
–10 |
–20 |
–29 |
µA |
|
Remote Shutdown Threshold |
Voltage at UVLO Falling |
0.32 |
0.66 |
|
V |
|
Remote Shutdown Hysteresis |
|
|
110 |
|
mV |
REGULATION AND OVERVOLTAGE COMPARATORS |
|
FB Regulation Level |
Internal Reference Trip Point for Switch ON |
1.2 |
1.225 |
1.25 |
V |
|
FB Overvoltage Threshold |
Trip Point for Switch OFF |
|
1.62 |
|
V |
|
FB Bias Current |
|
|
60 |
|
nA |
SWITCH CHARACTERISTICS |
|
Buck Switch RDS(ON) |
ITEST = 200 mA, BST-SW = 7 V |
|
0.8 |
1.8 |
Ω |
|
Synchronous RDS(ON) |
ITEST = 200 mA |
|
0.45 |
1 |
Ω |
|
Gate Drive UVLO |
VBST − VSW Rising |
2.4 |
3 |
3.6 |
V |
|
Gate Drive UVLO Hysteresis |
|
|
260 |
|
mV |
CURRENT LIMIT |
|
Current Limit Threshold |
|
0.7 |
1.02 |
1.3 |
A |
|
Current Limit Response Time |
Time to switch off |
|
150 |
|
ns |
|
OFF-Time Generator (Test 1) |
FB = 0.1 V, VIN = 48 V |
|
12 |
|
µs |
|
OFF-Time Generator (Test 2) |
FB = 1.0 V, VIN = 48 V |
|
2.5 |
|
µs |
THERMAL SHUTDOWN |
Tsd |
Thermal Shutdown Temperature |
|
|
165 |
|
°C |
|
Thermal Shutdown Hysteresis |
|
|
20 |
|
°C |
(1) All limits are specified by design. All electrical characteristics having room temperature limits are tested during production at TA = 25°C. All hot and cold limits are specified by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
(2) VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.
6.6 Switching Characteristics
Typical values correspond to TJ = 25°C. Minimum and maximum limits apply over –40°C to 125°C junction temperature range unless otherwise stated. VIN = 48 V unless otherwise stated.
|
PARAMETER |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
ON-TIME GENERATOR |
|
TON Test 1 |
VIN = 32 V, RON = 100 kΩ |
270 |
350 |
460 |
ns |
|
TON Test 2 |
VIN = 48 V, RON = 100 kΩ |
188 |
250 |
336 |
ns |
|
TON Test 3 |
VIN = 75 V, RON = 250 kΩ |
250 |
370 |
500 |
ns |
|
TON Test 4 |
VIN = 10 V, RON = 250 kΩ |
1880 |
3200 |
4425 |
ns |
MINIMUM OFF-TIME |
|
Minimum Off-Timer |
FB = 0 V |
|
144 |
|
ns |
6.7 Typical Characteristics
Figure 1. Efficiency at 750 kHz, VOUT1 = 10 V
Figure 3. VCC vs ICC
Figure 2. VCC vs VIN
Figure 4. ICC vs External VCC
Figure 7. IIN vs VIN (Operating, Non-switching)
Figure 6. TOFF (ILIM) vs VFB and VIN
Figure 8. IIN vs VIN (Shutdown)