SNIS159H August   1999  – December 2017 LM35

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM35A, LM35CA Limits
    6. 6.6 Electrical Characteristics: LM35A, LM35CA
    7. 6.7 Electrical Characteristics: LM35, LM35C, LM35D Limits
    8. 6.8 Electrical Characteristics: LM35, LM35C, LM35D
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM35 Transfer Function
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Drive Capability
    2. 8.2 Typical Application
      1. 8.2.1 Basic Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • NDV|3
  • LP|3
  • NEB|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from G Revision (August 2016) to H Revision

  • Changed NDV Package (TO-CAN) pinout from bottom view back to top view; added textnote to pinoutGo
  • Added pin numbers to the TO-CAN (TO46) pinoutGo

Changes from F Revision (January 2016) to G Revision

Changes from E Revision (January 2015) to F Revision

  • Changed NDV Package (TO-CAN) pinout from Top View to Bottom ViewGo

Changes from D Revision (October 2013) to E Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from C Revision (July 2013) to D Revision

  • Changed W to Ω Go
  • Changed W to Ω in Abs Max tablenote. Go