SNVS598B August   2010  – March 2018 LM3535

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Charge Pump
      2. 7.3.2 Diode Current Sinks
      3. 7.3.3 Ambient Light Sensing (ALS) And Interrupt
      4. 7.3.4 Dynamic Backlight Control Input (PWM Pin)
      5. 7.3.5 LED Forward Voltage Monitoring
      6. 7.3.6 Configurable Gain Transition Delay
      7. 7.3.7 Hardware Enable (HWEN)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
      2. 7.4.2 Standby
      3. 7.4.3 Active Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C Compatible Chip Address
        5. 7.5.1.5 Internal Registers of LM3535
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Ambient Light Sensing
          1. 8.2.2.1.1 Ambient Light Sensor Block
          2. 8.2.2.1.2 ALS Operation
            1. 8.2.2.1.2.1 ALS Configuration Example
          3. 8.2.2.1.3 ALS Averaging Time
          4. 8.2.2.1.4 Ambient Light Current Control + PWM
            1. 8.2.2.1.4.1 ALS + PWM Example
        2. 8.2.2.2 LED Configurations
        3. 8.2.2.3 Maximum Output Current, Maximum LED Voltage, Minimum Input Voltage
          1. 8.2.2.3.1 Total Output Current Capability
        4. 8.2.2.4 Parallel Connected and Unused Outputs
        5. 8.2.2.5 Power Efficiency
        6. 8.2.2.6 Power Dissipation
        7. 8.2.2.7 Thermal Protection
        8. 8.2.2.8 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MINMAXUNIT
VIN pin voltage –0.3 6 V
SCL, SDIO, HWEN, PWM pin voltages –0.3 (VIN + 0.3 V) with 6 V maximum V
IDxx pin voltages –0.3 (VVOUT + 0.3 V) with 6 V maximum V
Continuous power dissipation(4) Internally limited
Junction temperature, tJ-MAX 150 °C
Maximum lead temperature (soldering) See(5) °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pins.
(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications. All voltages are with respect to the potential at the GND pins.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and disengages at TJ = 125°C (typical).
(5) For detailed soldering specifications and information, see Texas Instruments Application Report AN-1112 DSBGA Wafer Level Chip Scale Package.