SNVS598B August   2010  – March 2018 LM3535

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Charge Pump
      2. 7.3.2 Diode Current Sinks
      3. 7.3.3 Ambient Light Sensing (ALS) And Interrupt
      4. 7.3.4 Dynamic Backlight Control Input (PWM Pin)
      5. 7.3.5 LED Forward Voltage Monitoring
      6. 7.3.6 Configurable Gain Transition Delay
      7. 7.3.7 Hardware Enable (HWEN)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
      2. 7.4.2 Standby
      3. 7.4.3 Active Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C Compatible Chip Address
        5. 7.5.1.5 Internal Registers of LM3535
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Ambient Light Sensing
          1. 8.2.2.1.1 Ambient Light Sensor Block
          2. 8.2.2.1.2 ALS Operation
            1. 8.2.2.1.2.1 ALS Configuration Example
          3. 8.2.2.1.3 ALS Averaging Time
          4. 8.2.2.1.4 Ambient Light Current Control + PWM
            1. 8.2.2.1.4.1 ALS + PWM Example
        2. 8.2.2.2 LED Configurations
        3. 8.2.2.3 Maximum Output Current, Maximum LED Voltage, Minimum Input Voltage
          1. 8.2.2.3.1 Total Output Current Capability
        4. 8.2.2.4 Parallel Connected and Unused Outputs
        5. 8.2.2.5 Power Efficiency
        6. 8.2.2.6 Power Dissipation
        7. 8.2.2.7 Thermal Protection
        8. 8.2.2.8 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Typical limits are TA = 25°C, and minimum and maximum limits in apply over the full operating temperature range (–30°C to +85°C). Unless otherwise specified: VIN = 3.6 V; VHWEN = VIN; VPWM = 0 V; VDxA = VDxB = VDxC = 0.4 V; GroupA = GroupB = GroupC = full-scale current; ENxA, ENxB, ENxC bits = 1; 53A, 62A bits = 0; C1 = C2 = CIN = COUT= 1 µF.(1)(2)(3)
PARAMETER TEST CONDITIONSMINTYPMAXUNIT
IDxx Output current regulation
GroupA 		2.7 V ≤ VIN ≤ 5.5 V
EN1A to EN4A = 1, 53A = 62A = 0, EN53 = EN62 = ENxB = ENxC = 0
4 LEDs in GroupA		 23.6
(–5.6%) 		25 26.3
(5.2%)		 mA
(%)
2.7 V ≤ VIN ≤ 5.5 V
EN1A to EN4A = EN53 = EN62 = 1, 53A = 62A = 1, ENxB = ENxC = 0
6 LEDs in GroupA		 23.2
(–7.2%) 		25 26.3
5.2% 		mA
(%)
Output current regulation
GroupB		 2.7 V ≤ VIN ≤ 5.5 V
EN1B = EN53 = EN62 = 1, 53A = 62A = 0, ENxA = ENC = 0
3 LEDs in GroupB		 23.3
(–6.8%) 		25 (+4%) mA
(%)
Output current regulation
IDC		 2.7 V ≤ VIN ≤ 5.5 V
ENC = 1, ENxA = ENxB = 0		 23.8
(–4.8%) 		25 26.8
(7.2%) 		mA
(%)
Output current regulation
GroupA, GroupB, and GroupC enabled		 3.2 V ≤ VIN ≤ 5.5V
VLED = 3.6 V 		25
DxA		 mA
25
DxB
25
DxC
IDxx-MATCH LED current matching(4) 2.7 V ≤ VIN ≤ 5.5 V GroupA (4 LEDs) 0.25% 2.4%
GroupA (6 LEDs) 0.55% 2.78
GroupB (3 LEDs) 0.25% 2.41%
VDxTH VDxx 1x to 3/2x gain transition threshold VDxA and/or VDxB falling 130 mV
VHR Current sink headroom voltage requirement(5) IDxx = 95% ×IDxx (nominal)
(IDxx (nominal) = 25 mA)		 100 mV
ROUT Open-loop charge pump output resistance Gain = 3/2 2.4 Ω
Gain = 1 0.5
IQ Quiescent supply current Gain = 3/2, no load 2.86 4.38 mA
Gain = 1, no load 1.09 2.31
ISB Standby supply current 2.7 V ≤ VIN ≤ 5.5 V
HWEN = VIN, all ENx bits = 0		 1.7 4 µA
ISD Shutdown supply current 2.7 V ≤ VIN ≤ 5.5 V
HWEN = 0 V, All ENx bits = 0		 1.7 4 µA
fSW Switching frequency 1.1 1.33 1.56 MHz
tSTART Start-up time VOUT = 90% steady state 250 µs
VALS ALS reference voltage accuracy 0.95
(–5%) 		1 1.05
5% 		V
RALS ALS resistor accuracy RALS = 9.08 kΩ –9% 9%
RALS = 5.46 kΩ –9% 9%
VHWEN HWEN voltage thresholds 2.7 V ≤ VIN ≤ 5.5 V Reset 0 0.45 V
Normal operation 1.2 VIN
VPWM PWM voltage thresholds 2.7 V ≤ VIN ≤ 5.5 V Diodes off 0 0.45 V
Diodes on 1.2 VIN
VOL-INT Interrupt output logic low 0 ILOAD = 3 mA 400 mV
I2C-COMPATIBLE INTERFACE VOLTAGE SPECIFICATIONS (SCL, SDIO)
VIL Input logic low 0 2.7 V ≤ VIN ≤ 5.5 V 0 0.45 V
VIH Input logic high 1 2.7 V ≤ VIN ≤ 5.5 V 1.2 VIN V
VOL SDIO output logic low 0 ILOAD = 3 mA 400 mV
I2C-COMPATIBLE INTERFACE TIMING SPECIFICATIONS (SCL, SDIO)
t1 SCL (clock period) See(6) 2.5 µs
t2 Data in setup time to SCL high 100 ns
t3 Data out stable after SCL low 0 ns
t4 SDIO low setup time to SCL low (start) 100 ns
t5 SDIO high hold time after SCL high (stop) 100 ns
(1) All voltages are with respect to the potential at the GND pins.
(2) Minimum and maximum limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely norm.
(3) CIN, CVOUT, C1, and C2 : Low-ESR surface-mount ceramic capacitors (MLCCs) used in setting electrical characteristics
(4) For the two groups of current sinks on a part (GroupA and GroupB), the following are determined: the maximum sink current in the group (MAX), the minimum sink current in the group (MIN), and the average sink current of the group (AVG). For each group, two matching numbers are calculated: (MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered the matching figure for the Group. The matching figure for a given part is considered to be the highest matching figure of the two Groups. The typical specification provided is the most likely norm of the matching figure for all parts.
(5) For each Dxxpin, headroom voltage is the voltage across the internal current sink connected to that pin. For Group A, B, and C current sinks, VHRx = VOUT – VLED. If headroom voltage requirement is not met, LED current regulation will be compromised.
(6) SCL is tested with a 50% duty-cycle clock.
LM3535 30082413.pngFigure 1. I2C Timing Diagram