SNVSAN4B April   2017  – October 2017 LM36010

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Flash Mode
      2. 7.3.2 Torch Mode
      3. 7.3.3 IR Mode
    4. 7.4 Device Functioning Modes
      1. 7.4.1 Start-Up (Enabling The Device)
      2. 7.4.2 Pass Mode
      3. 7.4.3 Input Voltage Flash Monitor (IVFM)
      4. 7.4.4 Fault/Protections
        1. 7.4.4.1 Overvoltage Protection (OVP)
        2. 7.4.4.2 Input Voltage Flash Monitor (IVFM)
        3. 7.4.4.3 LED and/or VOUT Short Fault
        4. 7.4.4.4 Current Limit (OCP)
        5. 7.4.4.5 Thermal Scale-Back (TSB)
        6. 7.4.4.6 Thermal Shutdown (TSD)
        7. 7.4.4.7 Undervoltage Lockout (UVLO)
        8. 7.4.4.8 Flash Time-out (FTO)
    5. 7.5 Programming
      1. 7.5.1 Control Truth Table
      2. 7.5.2 I2C-Compatible Interface
        1. 7.5.2.1 Data Validity
        2. 7.5.2.2 Start and Stop Conditions
        3. 7.5.2.3 Transferring Data
        4. 7.5.2.4 I2C-Compatible Chip Address
    6. 7.6 Register Descriptions
      1. 7.6.1 Enable Register (0x01)
      2. 7.6.2 Configuration Register (0x02)
      3. 7.6.3 LED Flash Brightness Register (0x03)
      4. 7.6.4 LED Torch Brightness Register (0x04)
      5. 7.6.5 Flags Register (0x05)
      6. 7.6.6 Device ID and RESET Register (0x06)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Thermal Performance
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Inductor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YKB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
IN, SW, OUT, LED −0.3 6 V
SDA, SCL, STROBE −0.3 (VIN+ 0.3) w/ 6 V maximum
Continuous power dissipation(3) Internally limited
Junction temperature, TJ-MAX 150 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and disengages at TJ = 135°C (typical). Thermal shutdown is ensured by design.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN 2.5 5.5 V
Junction temperature, TJ −40 125 °C
Ambient temperature, TA (3) −40 85 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.4 Thermal Information

THERMAL METRIC(1) LM36010 UNIT
YKB (DSBGA)
8 PINS
RθJA Junction-to-ambient thermal resistance 117.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.3 °C/W
RθJB Junction-to-board thermal resistance 34.3 °C/W
ΨJT Junction-to-top characterization parameter 0.5 °C/W
ΨJB Junction-to-board characterization parameter 34.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

TA = 25°C and VIN = 3.6 V, unless otherwise specified. Minimum and maximum limits apply over the full operating ambient temperature range (–40°C ≤ TA ≤ 85°C).(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CURRENT SOURCE SPECIFICATIONS
ILED Current source accuracy VOUT = 4 V , flash code = 0x7F = 1.5 A (3) –10% 1.5 10% A
VOUT = 4 V , torch code = 0x7F = 376 mA –10% 376 10% mA
VHR LED current source regulation voltage ILED = 1.5 A Flash 550 mV
ILED = 376 mA Torch 350
VOVP Overvoltage Protection ON threshold 4.86 5 5.10 V
OFF threshold 4.71 4.85 4.95
STEP-UP DC-DC CONVERTER SPECIFICATIONS
RPMOS PMOS switch on-resistance 175 mΩ
RNMOS NMOS switch on-resistance 130
ICL Switch current limit Reg 0x01, bit [5] = 0 –15% 1.9 15% A
Reg 0x01, bit [5] = 1 –15% 2.8 15%
VUVLO Undervoltage lockout threshold Falling VIN 2.5 V
VIVFM Input voltage flash monitor trip threshold Reg 0x02, bits [7:5] = 000 –3% 2.9 3% V
IQ Quiescent supply current Device not switching, in pass mode 0.3 mA
ISB Standby supply current Device disabled
2.5 V ≤ VIN ≤ 5.5 V		 0.8 4 µA
STROBE VOLTAGE SPECIFICATIONS
VIL Input logic low 2.5 V ≤ VIN ≤ 5.5 V 0 0.4 V
VIH Input logic high 1.2 VIN V
I2C-COMPATIBLE INTERFACE SPECIFICATIONS (SCL, SDA)
VIL Input logic low 2.5 V ≤ VIN ≤ 4.2 V 0 0.4 V
VIH Input logic high 1.2 VIN
VOL Output logic low ILOAD = 3 mA 400 mV
(1) Minimum (MIN) and Maximum (MAX) limits are specified by design, test, or statistical analysis. Typical (TYP) numbers are not verified, but do represent the most likely norm. Unless otherwise specified, conditions for typical specifications are: VIN = 3.6 V and TA = 25°C.
(2) All voltages are with respect to the potential at the GND pin.
(3) The ability to deliver 1.5 A of LED current is highly dependent upon the input voltage, LED voltage, ambient temperature and PCB layout.  Depending upon the system conditions, it is possible that the device could hit the internal thermal shutdown or thermal scale-back value before the desired flash duration is reached.  See Thermal Performance for more details.

6.6 Timing Requirements

MIN NOM MAX UNIT
t1 SCL clock period 2.4 µs
t2 Data in set-up time to SCL high 100 ns
t3 Data out stable after SCL low 0 ns
t4 SDA low set-up time to SCL low (start) 100 ns
t5 SDA high hold time after SCL high (stop) 100 ns

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ƒSW Switching frequency 2.5 V ≤ VIN ≤ 5.5 V -10% 2 10% MHz
-10% 4 10%
LM36010 30171819.gif Figure 1. I2C-Compatible Interface Specifications

6.8 Typical Characteristics

TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless otherwise noted.
LM36010 D001_SNVSAN4.gif
ƒSW = 2 MHz ICL = 2.8 A
Figure 2. LED Flash Current vs Brightness Code
LM36010 D003_SNVSAN4.gif
ƒSW = 2 MHz ICL = 2.8 A
Figure 4. LED Flash Current vs Input Voltage
LM36010 D005_SNVSAN4.gif
ƒSW = 2 MHz IFLASH = 1.5 A
ICL = 1.9 A Flash Time-out < 120 ms at 85°C
Figure 6. LED Flash Current vs Input Voltage
LM36010 D007_SNVSAN4.gif
ƒSW = 2 MHz IFLASH = 1.2 A
ICL = 1.9 A Flash Time-out < 280 ms at 85°C
Figure 8. LED Flash Current vs Input Voltage
LM36010 D009_SNVSAN4.gif
ƒSW = 2 MHz IFLASH = 1.03 A ICL = 1.9 A
Figure 10. LED Flash Current vs Input Voltage
LM36010 D011_SNVSAN4.gif
ƒSW = 2 MHz IFLASH = 1.03 A ICL = 2.8 A
Figure 12. LED Flash Current vs Input Voltage
LM36010 D013_SNVSAN4.gif
ƒSW = 2 MHz IFLASH = 0.75 A ICL = 1.9 A
Figure 14. LED Flash Current vs Input Voltage
LM36010 D015_SNVSAN4.gif
ƒSW = 2 MHz IFLASH = 0.75 A ICL = 2.8 A
Figure 16. LED Flash Current vs Input Voltage
LM36010 D017_SNVSAN4.gif
ƒSW = 2 MHz
Figure 18. LED Torch Current vs Brightness Code
LM36010 D019_SNVSAN4.gif
ƒSW = 2 MHz
Figure 20. LED Torch Current vs Input Voltage
LM36010 D021_SNVSAN4.gif
ƒSW = 2 MHz ITORCH = 376 mA
Figure 22. LED Torch Current vs Input Voltage
LM36010 D023_SNVSAN4.gif
ƒSW = 2 MHz ITORCH = 258 mA
Figure 24. LED Torch Current vs Input Voltage
LM36010 D025_SNVSAN4.gif
Mode (Reg 0x01 bits[1:0]) = 01 (IR Mode)
Figure 26. LED Off Current vs Input Voltage
LM36010 D027_SNVSAN4.gif
Figure 28. Standby Current vs Input Voltage
LM36010 D002_SNVSAN4.gif
ƒSW = 4 MHz ICL = 2.8 A
Figure 3. LED Flash Current vs Brightness Code
LM36010 D004_SNVSAN4.gif
.
ƒSW = 2 MHz ICL = 2.8 A
Figure 5. LED Flash Current vs Input Voltage
LM36010 D006_SNVSAN4.gif
ƒSW = 4 MHz IFLASH = 1.5 A
ICL = 1.9 A Flash Time-out < 120 ms at 85°C
Figure 7. LED Flash Current vs Input Voltage
LM36010 D008_SNVSAN4.gif
ƒSW = 4 MHz IFLASH = 1.2 A
ICL = 1.9 A Flash Time-out < 280 ms at 85°C
Figure 9. LED Flash Current vs Input Voltage
LM36010 D010_SNVSAN4.gif
ƒSW = 4 MHz IFLASH = 1.03 A ICL = 1.9 A
Figure 11. LED Flash Current vs Input Voltage
LM36010 D012_SNVSAN4.gif
ƒSW = 4 MHz IFLASH = 1.03 A ICL = 2.8 A
Figure 13. LED Flash Current vs Input Voltage
LM36010 D014_SNVSAN4.gif
ƒSW = 4 MHz IFLASH = 0.75 A ICL = 1.9 A
Figure 15. LED Flash Current vs Input Voltage
LM36010 D016_SNVSAN4.gif
ƒSW = 4 MHz IFLASH = 0.75 A ICL = 2.8 A
Figure 17. LED Flash Current vs Input Voltage
LM36010 D018_SNVSAN4.gif
ƒSW = 4 MHz
Figure 19. LED Torch Current vs Brightness Code
LM36010 D020_SNVSAN4.gif
ƒSW = 2 MHz
Figure 21. LED Torch Current vs Input Voltage
LM36010 D022_SNVSAN4.gif
ƒSW = 4 MHz ITORCH = 376 mA
Figure 23. LED Torch Current vs Input Voltage
LM36010 D024_SNVSAN4.gif
ƒSW = 2 MHz ITORCH = 188 mA
Figure 25. LED Torch Current vs Input Voltage
LM36010 D026_SNVSAN4.gif
Mode (Reg 0x01 bits[1:0]) = 10 (Torch Mode)
Figure 27. LED On Current vs Input Voltage