SNVSCV4 September   2024 LM3645

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Amplifier Synchronization (TORCH/TX)
      2. 6.3.2 Input Voltage Flash Monitor (IVFM)
      3. 6.3.3 Fault/Protections
        1. 6.3.3.1  Fault Operation
        2. 6.3.3.2  Flash Time-Out
        3. 6.3.3.3  Overvoltage Protection (OVP)
        4. 6.3.3.4  Current Limit
        5. 6.3.3.5  NTC Thermistor Input/Outputs (TEMP1, TEMP2)
        6. 6.3.3.6  Thermal Scale Back
        7. 6.3.3.7  Thermal Shutdown (TSD)
        8. 6.3.3.8  Undervoltage Lockout (UVLO)
        9. 6.3.3.9  LED and/or VOUT Short Fault
        10. 6.3.3.10 Fault Behavior Table
    4. 6.4 Device Functioning Modes
      1. 6.4.1 Flash Mode
      2. 6.4.2 Torch Mode
      3. 6.4.3 IR Mode
      4. 6.4.4 Voltage Mode
      5. 6.4.5 Mode Transitions
      6. 6.4.6 Boost Operation
        1. 6.4.6.1 Start-Up (Enabling The Device)
        2. 6.4.6.2 Pass Mode
        3. 6.4.6.3 Output Voltage Regulation
    5. 6.5 Programming and Control
      1. 6.5.1 Dx_EN Bits
      2. 6.5.2 STR1 and STR2 Usage
      3. 6.5.3 TOR/TX Usage
      4. 6.5.4 Control State Diagram
      5. 6.5.5 I2C-Compatible Interface
        1. 6.5.5.1 Data Validity
        2. 6.5.5.2 Start and Stop Conditions
        3. 6.5.5.3 Transferring Data
        4. 6.5.5.4 I2C-Compatible Chip Address
    6. 6.6 Register Descriptions
      1. 6.6.1 MainReg Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Output Control Examples
        1. 7.2.2.1 Four Channel Flash with Strobe1 Trigger Starting in Standby
        2. 7.2.2.2 Four Channel Flash with Strobe1 Trigger Starting in I2C Torch
        3. 7.2.2.3 Mixed Mode Functionality
        4. 7.2.2.4 Voltage Mode Only
        5. 7.2.2.5 Voltage Mode With Advanced IR
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Snubber Requirement
        2. 7.2.3.2 Output Capacitor Selection
        3. 7.2.3.3 Input Capacitor Selection
        4. 7.2.3.4 Inductor Selection
      4. 7.2.4 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)LM3645UNIT
YCG (DSBGA)
25 PINS
RθJAJunction-to-ambient thermal resistance71.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance0.4°C/W
RθJBJunction-to-board thermal resistance19.6°C/W
ψJTJunction-to-top characterization parameter0.2°C/W
ψJBJunction-to-board characterization parameter19.5°C/W
(1) For more information about traditional and new thermalmetrics, see the Semiconductor and ICPackage Thermal Metrics application report.