SNVS250F November   2004  – February 2016 LM3670

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Connection Diagram
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Circuit Operation
      2. 7.3.2 Soft Start
      3. 7.3.3 LDO - Low Dropout Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
        1. 7.4.1.1 Internal Synchronous Rectification
        2. 7.4.1.2 Current Limiting
      2. 7.4.2 PFM Operation
      3. 7.4.3 Shutdown
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application: Fixed Output
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
            1. 8.2.1.2.1.1 Method 1
            2. 8.2.1.2.1.2 Method 2
          2. 8.2.1.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Output Capacitor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application: Adjustable Output
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Voltage Selection for Adjustable LM3670
        3. 8.2.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

PC board layout is an important part of DC-DC converter design. Poor board layout can disrupt the performance of a DC-DC converter and surrounding circuitry by contributing to EMI, ground bounce, and resistive voltage loss in the traces, which can send erroneous signals to the DC-DC converter device, resulting in poor regulation or instability.

Good layout for the LM3670 can be implemented by following a few simple design rules, as shown in Figure 23.

  • Place the LM3670, inductor and filter capacitors close together and make the traces short. The traces between these components carry relatively high switching currents and act as antennas. Following this rule reduces radiated noise. Place the capacitors and inductor within 0.2 in. (5 mm) of the LM3670.
  • Arrange the components so that the switching current loops curl in the same direction. During the first half of each cycle, current flows from the input filter capacitor, through the LM3670 and inductor to the output filter capacitor and back through ground, forming a current loop. In the second half of each cycle, current is pulled up from ground, through the LM3670 by the inductor, to the output filter capacitor and then back through ground, forming a second current loop. Routing these loops so the current curls in the same direction prevents magnetic field reversal between the two half-cycles and reduces radiated noise.
  • Connect the ground pins of the LM3670, and filter capacitors together using generous component-side copper fill as a pseudo-ground plane. Then, connect this to the ground-plane (if one is used) with several vias. This reduces ground-plane noise by preventing the switching currents from circulating through the ground plane. It also reduces ground bounce at the LM3670 by giving it a low-impedance ground connection.
  • Use wide traces between the power components and for power connections to the DC-DC converter circuit. This reduces voltage errors caused by resistive losses across the traces.
  • Route noise sensitive traces, such as the voltage feedback path, away from noisy traces between the power components. The voltage feedback trace must remain close to the LM3670 circuit, and be direct but must be routed opposite to noisy components. This reduces EMI radiated onto the DC-DC converter’s own voltage feedback trace.
  • Place noise sensitive circuitry, such as radio IF blocks, away from the DC-DC converter, CMOS digital blocks and other noisy circuitry. Interference with noise-sensitive circuitry in the system can be reduced through distance.

In mobile phones, for example, a common practice is to place the DC-DC converter on one corner of the board, arrange the CMOS digital circuitry around it (because this also generates noise), and then place sensitive pre-amplifiers and IF stages on the diagonally opposing corner. Often, the sensitive circuitry is shielded with a metal pan and, by using low-dropout linear regulators, power to the circuit is post-regulated to reduce conducted noise.

10.2 Layout Example

LM3670 brd_lyout_nvs250.gif Figure 23. LM3670 Layout