SNVS294S November   2004  – May 2016 LM3671 , LM3671-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM3671
    3. 6.3 ESD Ratings: LM3671-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Dissipation Ratings
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Circuit Operation
      2. 7.3.2 Soft Start
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
        1. 7.4.1.1 Internal Synchronous Rectification
        2. 7.4.1.2 Current Limiting
      2. 7.4.2 PFM Operation
      3. 7.4.3 Shutdown
      4. 7.4.4 Low Dropout Operation (LDO)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application: Fixed-Voltage Version
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
            1. 8.2.1.2.1.1 Method 1
            2. 8.2.1.2.1.2 Method 2
          2. 8.2.1.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Output Capacitor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application: ADJ Version
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Voltage Selection for LM3671-ADJ
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 DSBGA Package Assembly and Use
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from R Revision (November 2014) to S Revision

  • Added top nav icon for TI Design Go
  • Added several new "Applications" Go
  • moved storage temperature to Abs Max table Go
  • Changed Handling Ratings to ESD Ratings Go
  • Changed RθJA for USON from 165°C/W to 174.7°C/W; for SOT-23 from 130°C/W to 165.7°C/W, and for DSBGA from 85°C/W to 181.0°C/W; added additional thermal valuesGo
  • Changed RθJA values in Dissipation Ratings tableGo

Changes from Q Revision (November 2013) to R Revision

  • Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section Go

Changes from O Revision (April 2013) to P Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo