SLVSE73 June   2017 LM385-1.2-MIL

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Thermocouple Cold-Junction Compensator
      2. 8.3.2 Generating Reference Voltage with a Constant Current Source
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • YS|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
IR Reverse current 30 mA
IF Forward current 10 mA
TJ Operating virtual junction temperature 150 °C
Tstg Storage temeprature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
IZZ Reference current 0.01 20 mA
TA Operating free-air temperature 0 70 °C

6.4 Thermal Information

THERMAL METRIC(1) LMx85-1.2-MIL UNIT
D LP PS PW
8 PINS 3 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 97 140 95 149 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TA(1) MIN TYP MAX UNIT
VZ Reference voltage IZ = I(min) to 20 mA(2) 25°C 1.21 1.235 1.26 V
αVZ Average temperature coefficient of reference voltage(3) IZ = I(min) to 20 mA(2) Full range ±20 ppm/°C
ΔVZ Change in reference voltage with current IZ = I(min) to 1 mA(2) 25°C 1 mV
Full range 1.5
IZ = I(min) to 20 mA 25°C 20
Full range 30
ΔVZ/Δt Long-term change in reference voltage IZ = 100 µA 25°C ±20 ppm/khr
IZ(min) Minimum reference current Full range 8 15 µA
ZZ Reference impedance IZ = 100 µA, f = 25 Hz 25°C 0.4 1 Ω
Full range 1.5
Vn Broadband noise voltage IZ = 100 µA, f = 10 Hz to 10 kHz 25°C 60 µV
(1) Full range is −40°C to 85°C for the LM385-1.2-MIL.
(2) I(min) = 15 μA for the LM385-1.2-MIL.
(3) The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified temperature range.

6.6 Typical Characteristics

LM385-1.2-MIL tc1_slvs075.gif Figure 1. Reverse Current vs Reverse Voltage
LM385-1.2-MIL tc2_slvs075.gif Figure 2. Reference Voltage Change vs Reverse Current
LM385-1.2-MIL tc3_slvs075.gif Figure 3. Forward Voltage vs Forward Current
LM385-1.2-MIL tc5_slvs075.gif Figure 5. Reference Impedance vs Reference Current
LM385-1.2-MIL tc7_slvs075.gif Figure 7. Output Noise Voltage vs Cutoff Frequency
LM385-1.2-MIL tc4_slvs075.gif Figure 4. Reference Voltage vs Free-Air Temperature
LM385-1.2-MIL tc6_slvs075.gif Figure 6. Noise Voltage vs Frequency