SLVS075J April   1989  – January 2015 LM285-1.2 , LM385-1.2 , LM385B-1.2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • PW|8
  • LP|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
IR Reverse Current 30 mA
IF Forward Current 10 mA
TJ Operating virtual junction temperature 150 °C
Tstg Storage temeprature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
IZZ Reference current 0.01 20 mA
TA Operating free-air temperature LM285-1.2 –40 85 °C
LM385-1.2, LM385B-1.2 0 70

7.4 Thermal Information

THERMAL METRIC(1) LMx85-1.2 UNIT
D LP PS PW
8 PINS 3 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 97 140 95 149 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TA(1) LM285-1.2 LM385-1.2 LM385B-1.2 UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
VZ Reference voltage IZ = I(min) to 20 mA(2) 25°C 1.223 1.235 1.247 1.21 1.235 1.26 1.223 1.235 1.247 V
αVZ Average temperature coefficient of reference voltage(3) IZ = I(min) to 20 mA(2) Full Range ±20 ±20 ±20 ppm/°C
ΔVZ Change in reference voltage with current IZ = I(min) to 1 mA(2) 25°C 1 1 1 mV
Full Range 1.5 1.5 1.5
IZ = I(min) to 20 mA 25°C 12 20 20
Full Range 30 30 30
ΔVZ/Δt Long-term change in reference voltage IZ = 100 µA 25°C ±20 ±20 ±20 ppm/khr
IZ(min) Minimum reference current Full Range 8 10 8 15 8 15 µA
ZZ Reference impedance IZ = 100 µA, f = 25 Hz 25°C 0.2 0.6 0.4 1 0.4 1 Ω
Full Range 1.5 1.5 1.5
Vn Broadband noise voltage IZ = 100 µA, f = 10 Hz to 10 kHz 25°C 60 60 60 µV
(1) Full range is −40°C to 85°C for the LM285-1.2 and 0°C to 70°C for the LM385-1.2 and LM385B-1.2.
(2) I(min) = 10 μA for the LM285-1.2 and 15 μA for the LM385-1.2 and LM385B-1.2
(3) The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified temperature range.

7.6 Typical Characteristics

tc1_slvs075.gifFigure 1. Reverse Current vs Reverse Voltage
tc2_slvs075.gifFigure 2. Reference Voltage Change vs Reverse Current
tc3_slvs075.gifFigure 3. Forward Voltage vs Forward Current
tc5_slvs075.gifFigure 5. Reference Impedance vs Reference Current
tc7_slvs075.gifFigure 7. Output Noise Voltage vs Cutoff Frequency
tc4_slvs075.gifFigure 4. Reference Voltage vs Free-Air Temperature
tc6_slvs075.gifFigure 6. Noise Voltage vs Frequency