SLVS023L January   1989  – February 2018 LM285-2.5 , LM385-2.5 , LM385B-2.5

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Thermocouple Cold-Junction Compensator
      2. 8.3.2 Generating Reference Voltage With a Constant Current Source
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)LMx85-2.5, LM385B-2.5UNIT
D (SOIC)LP (T0-92)PW (TSSOP)
8 PINS3 PINS8 PINS
RθJA Junction-to-ambient thermal resistance 112 157 168.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.5 80.3 53.7 °C/W
RθJB Junction-to-board thermal resistance 52.1 N/A 96.4 °C/W
ψJT Junction-to-top characterization parameter 15.8 24.6 4.5 °C/W
ψJB Junction-to-board characterization parameter 51.7 136.2 94.7 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics (SPRA953) application report.