SLCS146G February   2005  – July 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: ADJ Pinouts
  6. 5 Functional Block Diagram
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 LM4041x12I Electrical Characteristics
    4. 6.4 LM4041x12I Electrical Characteristics
    5. 6.5 LM4041x12Q Electrical Characteristics
    6. 6.6 LM4041xI (Adjustable Version) Electrical Characteristics
    7. 6.7 LM4041xI (Adjustable Version) Electrical Characteristics
    8. 6.8 LM4041xQ (Adjustable Version) Electrical Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Application Information
    1. 7.1 Output Capacitor
    2. 7.2 SOT-23 and SC-70 Pin Connections
    3. 7.3 Adjustable Version
    4. 7.4 Cathode and Load Currents
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Trademarks
    3. 8.3 Electrostatic Discharge Caution
    4. 8.4 Support Resources
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3 Electrostatic Discharge Caution

LM4041 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.