SLCS146G February   2005  – July 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: ADJ Pinouts
  6. 5 Functional Block Diagram
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 LM4041x12I Electrical Characteristics
    4. 6.4 LM4041x12I Electrical Characteristics
    5. 6.5 LM4041x12Q Electrical Characteristics
    6. 6.6 LM4041xI (Adjustable Version) Electrical Characteristics
    7. 6.7 LM4041xI (Adjustable Version) Electrical Characteristics
    8. 6.8 LM4041xQ (Adjustable Version) Electrical Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Application Information
    1. 7.1 Output Capacitor
    2. 7.2 SOT-23 and SC-70 Pin Connections
    3. 7.3 Adjustable Version
    4. 7.4 Cathode and Load Currents
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Trademarks
    3. 8.3 Electrostatic Discharge Caution
    4. 8.4 Support Resources
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over free-air temperature range (unless otherwise noted)
MIN MAX(1) UNIT
VZ Continuous cathode voltage 15 V
IZ Continuous cathode current –10 25 mA
θJA Package thermal impedance(2)(3) DBZ package 206 °C/W
DCK package 252
LP package 156
TJ Operating virtual junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.