SNOS491D February   2000  – September 2018 LM4051-N

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1. 1.2 VREF Simplified Schematic
      2.      Adjustable Reference Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 LM4051-1.2 Electrical Characteristics
    6. 6.6 LM4051-ADJ Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 LM4051-N - 1.2 V
      2. 8.4.2 LM4051-N - ADJ
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Shunt Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Adjustable Shunt Regulator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM4051-ADJ, LM4051-1.2 V UNIT
DBZ
3 PINS
RθJA Junction-to-ambient thermal resistance 214.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76.4 °C/W
RθJB Junction-to-board thermal resistance 41.3 °C/W
ψJT Junction-to-top characterization parameter 2.0 °C/W
ψJB Junction-to-board characterization parameter 40.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.