SNAS470E October   2008  – November 2015 LM48100Q-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for VDD = 5 V
    6. 6.6  Electrical Characteristics for VDD = 5 V at Extended Temperature Limits
    7. 6.7  Electrical Characteristics for VDD = 3.6 V
    8. 6.8  Electrical Characteristics for VDD = 3.6 V at Extended Temperature Limits
    9. 6.9  I2C Interface Characteristics for VDD = 5 V, 2.2 V ≤ I2C VDD ≤ 5.5 V
    10. 6.10 I2C Interface Characteristics for VDD = 5 V, 1.8 V ≤ I2C VDD ≤ 2.2 V
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Diagnostic Control
      2. 7.3.2 Fault Detection Control Register
      3. 7.3.3 General Amplifier Function
        1. 7.3.3.1 Bridge Configuration Explained
        2. 7.3.3.2 Input Mixer/Multiplexer
      4. 7.3.4 Output Fault Detection
        1. 7.3.4.1 Output Short to Supplies (VDD or GND)
        2. 7.3.4.2 Output Short Circuit and Open Circuit Detection
        3. 7.3.4.3 Output Over-Current Detection
        4. 7.3.4.4 Thermal Overload Detection
      5. 7.3.5 Open FAULT Output
      6. 7.3.6 Volume Control
      7. 7.3.7 Shutdown Function
      8. 7.3.8 Power Dissipation
    4. 7.4 Device Functional Modes
      1. 7.4.1 One-Shot Mode
      2. 7.4.2 Continuous Diagnostic Mode
    5. 7.5 Programming
      1. 7.5.1 Write-Only I2C Compatible Interface
      2. 7.5.2 I2C Bus Format
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Supply Bypassing/Filtering
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Bias Capacitor Selection
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Exposed DAP Mounting Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.