SNAS513F August   2011  – November 2015 LM48560

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics VDD = 3.6 V
    5. 6.5 I2C Interface Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 General Amplifier Function
      2. 8.3.2 Class H Operation
      3. 8.3.3 Differential Amplifier Explanation
      4. 8.3.4 Automatic Level Control (ALC)
      5. 8.3.5 Attack Time
      6. 8.3.6 Release Time
      7. 8.3.7 Boost Converter
      8. 8.3.8 Gain Setting
      9. 8.3.9 Shutdown Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Software or Hardware Mode
      2. 8.4.2 Single-Ended Input Configuration
    5. 8.5 Programming
      1. 8.5.1 Read/Write I2C Compatible Interface
      2. 8.5.2 Write Sequence
      3. 8.5.3 Read Sequence
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Proper Selection of External Components
          1. 9.2.2.1.1 ALC Timing (CSET) Capacitor Selection
          2. 9.2.2.1.2 Power Selection of External Components
          3. 9.2.2.1.3 Boost Converter Capacitor Selection
          4. 9.2.2.1.4 Inductor Selection
          5. 9.2.2.1.5 Diode Selection
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.