SNVS496F January   2007  – May 2021 LM5002

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Voltage VCC Regulator
      2. 7.3.2 Oscillator
      3. 7.3.3 External Synchronization
      4. 7.3.4 Enable and Standby
      5. 7.3.5 Error Amplifier and PWM Comparator
      6. 7.3.6 Current Amplifier and Slope Compensation
      7. 7.3.7 Power MOSFET
    4. 7.4 Device Functional Modes
      1. 7.4.1 Thermal Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 VIN
      2. 8.1.2 SW PIN
      3. 8.1.3 EN or UVLO Voltage Divider Selection
      4. 8.1.4 Soft Start
    2. 8.2 Typical Applications
      1. 8.2.1 Non-Isolated Flyback Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Switching Frequency
          2. 8.2.1.2.2 Flyback Transformer
          3. 8.2.1.2.3 Peak MOSFET Current
          4. 8.2.1.2.4 Output Capacitance
          5. 8.2.1.2.5 Output Diode Rating
          6. 8.2.1.2.6 Power Stage Analysis
          7. 8.2.1.2.7 Loop Compensation
      2. 8.2.2 Isolated Flyback Regulator
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 Boost Regulator
        1. 8.2.3.1 Design Requirements
      4. 8.2.4 24-V SEPIC Regulator
        1. 8.2.4.1 Design Requirements
      5. 8.2.5 12-V Automotive SEPIC Regulator
        1. 8.2.5.1 Design Requirements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (December 2016) to Revision F (May 2021)

  • Updated the numbering format for tables, figures and cross-references throughout the document. Go
  • Changed LM5005 to LM5002Go

Changes from Revision D (March 2013) to Revision E (December 2016)

  • Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed Junction to Ambient, RθJA, values in Thermal Information table From: 140 To: 105.7 (SOIC) and From: 40 To: 37.1 (WSON)Go
  • Changed Junction to Case, θJC, values in Thermal Information table From: 32 To: 50.8 (SOIC) and From: 4.5 To: 25.8 (WSON)Go

Changes from Revision C (March 2013) to Revision D (March 2013)

  • Changed layout of National Semiconductor Data Sheet to TI formatGo