SNVS496F January   2007  – May 2021 LM5002

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Voltage VCC Regulator
      2. 7.3.2 Oscillator
      3. 7.3.3 External Synchronization
      4. 7.3.4 Enable and Standby
      5. 7.3.5 Error Amplifier and PWM Comparator
      6. 7.3.6 Current Amplifier and Slope Compensation
      7. 7.3.7 Power MOSFET
    4. 7.4 Device Functional Modes
      1. 7.4.1 Thermal Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 VIN
      2. 8.1.2 SW PIN
      3. 8.1.3 EN or UVLO Voltage Divider Selection
      4. 8.1.4 Soft Start
    2. 8.2 Typical Applications
      1. 8.2.1 Non-Isolated Flyback Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Switching Frequency
          2. 8.2.1.2.2 Flyback Transformer
          3. 8.2.1.2.3 Peak MOSFET Current
          4. 8.2.1.2.4 Output Capacitance
          5. 8.2.1.2.5 Output Diode Rating
          6. 8.2.1.2.6 Power Stage Analysis
          7. 8.2.1.2.7 Loop Compensation
      2. 8.2.2 Isolated Flyback Regulator
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 Boost Regulator
        1. 8.2.3.1 Design Requirements
      4. 8.2.4 24-V SEPIC Regulator
        1. 8.2.4.1 Design Requirements
      5. 8.2.5 12-V Automotive SEPIC Regulator
        1. 8.2.5.1 Design Requirements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

The LM5002 current sense and PWM comparators are very fast and may respond to short duration noise pulses. The components at the SW, COMP, EN and the RT pins must be as physically close as possible to the IC, thereby minimizing noise pickup on the PCB tracks.

The SW pin of the LM5002 must have a short, wide conductor to the power path inductors, transformers and capacitors to minimize parasitic inductance that reduces efficiency and increases conducted and radiated noise. Ceramic decoupling capacitors are recommended between the VIN and GND pins and between the VCC and GND pins. Use short, direct connections to avoid clock jitter due to ground voltage differentials. Small package surface mount X7R or X5R capacitors are preferred for high-frequency performance and limited variation over temperature and applied voltage.

If an application using the LM5002 results high junction temperatures during normal operation, multiple vias from the GND pin to a PCB ground plane help conduct heat away from the IC. Judicious positioning of the PCB within the end product, along with use of any available air flow helps reduce the junction temperatures. If using forced air cooling, avoid placing the LM5002 in the air flow shadow of large components, such as input capacitors, inductors or transformers.