SNVS280I April   2004  – October 2018 LM5008

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit and Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hysteretic Control Circuit Overview
      2. 7.3.2 High Voltage Start-Up Regulator
      3. 7.3.3 Regulation Comparator
      4. 7.3.4 Overvoltage Comparator
      5. 7.3.5 On-Time Generator and Shutdown
      6. 7.3.6 Current Limit
      7. 7.3.7 N-Channel Buck Switch and Driver
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Minimum Load Current
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Custom Design With WEBENCH® Tools
      3. 11.1.3 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
        1. 11.2.1.1 PCB Layout Resources
        2. 11.2.1.2 Thermal Design Resources
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Specifications are for TJ = 25°C and VIN = 48 V (unless otherwise stated)(1).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC SUPPLY
VCC Reg VCC regulator output TJ = 25°C 7 V
TJ = –40°C to 125°C 6.6 7.4
VCC current limit(2) 9.5 mA
VCC undervoltage lockout voltage VCC increasing 6.3 V
VCC undervoltage hysteresis 200 mV
VCC UVLO delay (filter) 100-mV overdrive 10 µs
IIN operating current Non-switching, FB = 3 V TJ = 25°C 485 µA
TJ = –40°C to 125°C 675
IIN shutdown current RON/SD = 0 V TJ = 25°C 76 µA
TJ = –40°C to 125°C 150
CURRENT LIMIT
Current limit threshold TJ = 25°C 0.51 A
TJ = –40°C to 125°C 0.41 0.61
Current limit response time Iswitch overdrive = 0.1 A, time to switch off 400 ns
OFF time generator (test 1) FB = 0 V, RCL = 100 K 35 µs
OFF time generator (test 2) FB = 2.3 V, RCL = 100 K 2.56 µs
ON-TIME GENERATOR
TON – 1 VIN = 10 V, RON = 200 K TJ = 25°C 2.77 µs
TJ = –40°C to 125°C 2.15 3.5
TON – 2 VIN = 95 V, RON = 200 K TJ = 25°C 300 ns
TJ = –40°C to 125°C 200 420
Remote shutdown threshold Rising TJ = 25°C 0.7 V
TJ = –40°C to 125°C 0.4 1.05
Remote shutdown hysteresis 35 mV
MINIMUM OFF-TIME
Minimum off-timer FB = 0 V 300 ns
REGULATION AND OV COMPARATORS
FB reference threshold Internal reference, trip point for switch ON TJ = 25°C 2.5 V
TJ = –40°C to 125°C 2.445 2.55
FB overvoltage threshold Trip point for switch OFF 2.875 V
FB bias current 100 nA
THERMAL SHUTDOWN
Tsd Thermal shutdown temperature 165 °C
Thermal shutdown hysteresis 25 °C
(1) All electrical characteristics having room temperature limits are tested during production with TA = TJ = 25°C. All hot and cold limits are specified by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
(2) The VCC output is intended as a self bias for the internal gate drive power and control circuits. Device thermal limitations limit external loading.