SNVS280I April   2004  – October 2018 LM5008

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit and Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hysteretic Control Circuit Overview
      2. 7.3.2 High Voltage Start-Up Regulator
      3. 7.3.3 Regulation Comparator
      4. 7.3.4 Overvoltage Comparator
      5. 7.3.5 On-Time Generator and Shutdown
      6. 7.3.6 Current Limit
      7. 7.3.7 N-Channel Buck Switch and Driver
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Minimum Load Current
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Custom Design With WEBENCH® Tools
      3. 11.1.3 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
        1. 11.2.1.1 PCB Layout Resources
        2. 11.2.1.2 Thermal Design Resources
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM5008 UNIT
DGK (VSSOP) NGU (WSON)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 139.7 42 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.2 27.6 °C/W
RθJB Junction-to-board thermal resistance 70.5 18.5 °C/W
ψJT Junction-to-top characterization parameter 3.4 0.3 °C/W
ψJB Junction-to-board characterization parameter 69.5 18.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 4.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.