SNVSCA9 October   2022 LM5012

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings_Catalog
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Control Architecture
      2. 8.3.2  Internal VCC Regulator and Bootstrap Capacitor
      3. 8.3.3  Regulation Comparator
      4. 8.3.4  Internal Soft Start
      5. 8.3.5  On-Time Generator
      6. 8.3.6  Current Limit
      7. 8.3.7  N-Channel Buck Switch and Driver
      8. 8.3.8  Schottky Diode Selection
      9. 8.3.9  Enable and Undervoltage Lockout (EN/UVLO)
      10. 8.3.10 Power Good (PGOOD)
      11. 8.3.11 Thermal Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
      4. 8.4.4 Sleep Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Switching Frequency (RRON)
        3. 9.2.2.3 Buck Inductor (LO)
        4. 9.2.2.4 Schottky Diode (DSW)
        5. 9.2.2.5 Output Capacitor (COUT)
        6. 9.2.2.6 Input Capacitor (CIN)
        7. 9.2.2.7 Type 3 Ripple Network
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Compact PCB Layout for EMI Reduction
        2. 9.4.1.2 Feedback Resistors
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

Figure 6-1 8-Pin SO PowerPAD™DDA integrated circuit Package(Top View)
Table 6-1 Pin Functions
Pin Type(1) Description
Name NO.
GND 1 G Ground connection for internal circuits
VIN 2 P/I Regulator supply input pin to the high-side power MOSFET and internal bias regulator. Connect directly to the input supply of the buck converter with short, low impedance paths.
EN/UVLO 3 I Precision enable and undervoltage lockout (UVLO) programming pin. If the EN/UVLO voltage is below 1.1 V, the converter is in shutdown mode with all functions disabled. If the UVLO voltage is greater than 1.1 V and below 1.5 V, the converter is in standby mode with the internal VCC regulator operational and no switching. If the EN/UVLO voltage is above 1.5 V, the start-up sequence begins.
RON 4 I On-time programming pin. A resistor between this pin and GND sets the buck switch on time.
FB 5 I Feedback input of voltage regulation comparator
PGOOD 6 O Power-good indicator. This pin is an open-drain output pin. Connect to a source voltage through an external pullup resistor between 10 kΩ to 100 kΩ.
BST 7 P/I Bootstrap gate-drive supply. Connect a high-quality 2.2-nF, 50-V X7R ceramic capacitor between BST and SW to bias the internal high-side gate driver.
SW 8 P Switching node that is internally connected to the source of the high-side NMOS buck switch. Connect to the switching node of the power inductor.
EP — — Exposed pad of the package. No internal electrical connection. Connect the EP to the GND pin and connect to a large copper plane to reduce thermal resistance.
(1) G = Ground, I = Input, O = Output, P = Power