SNVS181C April   2004  – August 2016 LM5033

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Voltage Start-Up Regulator (VIN and VCC)
      2. 7.3.2 Reference (REF)
      3. 7.3.3 PWM Comparator (COMP), Duty Cycle and Deadtime
      4. 7.3.4 Current Sense (CS)
      5. 7.3.5 Oscillator, Sync Capability (RT/SYNC)
      6. 7.3.6 Soft Start (SS)
      7. 7.3.7 OUT1 and OUT2
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VIN
        2. 8.2.2.2 VCC
        3. 8.2.2.3 Soft Start (SS)
        4. 8.2.2.4 Current Sense (CS)
        5. 8.2.2.5 Oscillator, Sync Input (RT/SYNC)
        6. 8.2.2.6 Deadtime Adjustment
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (April 2013) to C Revision

  • Added Device Information table, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Thermal Information table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information Table; see POA at the end of the datasheetGo
  • Changed values in the Thermal Information table to align with JEDEC standards Go

Changes from A Revision (May 2005) to B Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo